Cutting method for cutting substrate by utilizing cutting line

Abstract

The invention discloses a cutting method for cutting a substrate by utilizing a cutting line (1), comprising the following steps of: judging whether the cutting line (1) subjected to the first cutting can be used for secondary cutting or not after the first cutting is finished; if so, carrying out secondary cutting by properly lowering the operation speed of an operating platform and the tension of the cutting line (1) and properly increasing the operation speed of the cutting line (1); then secondarily judging whether the cutting line (1) can be used for secondary cutting or not, and scrapping till the cutting line (1) can not be used for secondary cutting. The cutting method provided by the invention not only improves the utilization ratio of the cutting line (1) and lowers the cost forcutting the substrate, but also lowers the pressure for dealing with waste materials.

Description

technical field [0001] The invention relates to the field of mechanical processing, in particular to a cutting method for cutting a substrate by using a cutting line. Background technique [0002] Silicon wafers are the main production material in the semiconductor and photovoltaic fields. Silicon wafer wire cutting technology is a relatively advanced processing technology in the world at present. [0003] Silicon wafer steel wire cutting technology uses a high-speed moving steel wire to drive the cutting mortar attached to the wire to rub against the silicon wafer, while the silicon wafer waits for the workpiece to be processed and the workpiece to be processed is fed through the lowering of the cutting machine table. , so as to achieve the cutting effect. [0004] Silicon wafer steel wire cutting technology replaces the original inner circle cutting equipment. Compared with the inner circle slicing process, the cut wafer has less curvature, less warpage, better paralleli...

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Problems solved by technology

[0005] However, during the cutting process, the wear of the steel wire is relatively serious. After a cut, the steel wire becomes very thin, and its sand carrying capacity (that is, the amount of cutting mortar attached to the steel wire) will also decrease, resulting in a decrease in cutting ability. It is easy to cause the phenomenon of skewing and affect the cutting quality; on the other hand, the breaking force that the steel wire can withstand will also decrease after the steel wire becomes thinner, which will easily cause the occurrence of wire breakage during the cutting process.

[0006] Therefore, in the prior art, the steel wire generally needs to be discarded after one cutting, so that, on the one hand, there is a backlog of waste objects, which is difficult to handle; The main raw materials account for a large proportion of the cutting cost, resulting in an increase in the cost of silicon wafer cutting and a waste of resources

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