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Method for judging pass/fail of bonding, apparatus for judging pass/fail of bonding, and bonding apparatus

A technology of a welding device and a judging method, which is applied to welding equipment, non-electric welding equipment, electrical components, etc., can solve problems such as failure to find defective products, deterioration of product yield, and failure to implement visual inspection procedures for welding parts.

Active Publication Date: 2011-06-15
SHINKAWA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, when the visual inspection process of the welded part is not performed in the mid-production process, defective products cannot be found before the final inspection process, and there is a problem that the product yield deteriorates.

Method used

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  • Method for judging pass/fail of bonding, apparatus for judging pass/fail of bonding, and bonding apparatus
  • Method for judging pass/fail of bonding, apparatus for judging pass/fail of bonding, and bonding apparatus
  • Method for judging pass/fail of bonding, apparatus for judging pass/fail of bonding, and bonding apparatus

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Embodiment Construction

[0085] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Such as figure 1 As shown, the lead wire bonding device 10 equipped with the bonding quality judging device of this embodiment includes a bonding head 11 as a base portion, an ultrasonic vibrator 13, an ultrasonic mold 12, a capillary 17 as a welding tool, and a flange on the ultrasonic mold 12. 14. A welding arm 21, a load sensor 31, a drive motor 45, a control unit 60, and a welding table 33 for absorbing and fixing a semiconductor chip 34 and a substrate 35 as welding objects.

[0086] A driving motor 45 for driving the welding arm 21 to rotate is provided on the welding head 11 . The ultrasonic vibrator 13 is formed by stacking a plurality of piezoelectric elements, and is mounted on the rear end side of the ultrasonic mold 12 . Also, a capillary 17 is attached to the tip of the ultrasonic mold 12 . The flange 14 is provided at a position to be a vi...

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Abstract

An apparatus for judging pass / fail of bonding for a bonding apparatus comprises an ultrasonic horn performing longitudinal vibration in the direction of the central axis by resonating with the vibration of an ultrasonic vibrator; a capillary fixed to the antinode of vibration of the ultrasonic horn; a flange provided at the node of vibration of the ultrasonic horn; a bonding arm; and a load sensor fixed between the center of rotation of the bonding arm and the flange fixing surface while being offset in the direction approaching to and receding from a bonding object from the central axis of the ultrasonic horn in the longitudinal direction. The load sensor continuously detects the load applied to a bonding tool in the direction approaching to and receding from the bonding object at the time of bonding, the maximum value of detected load is set as an impact load and then pass / fail judgment is made on bonding based on the impact load. Consequently, the pass / fail judgment is made on bonding while bonding is being performed.

Description

technical field [0001] The invention relates to a welding quality judgment method of a welding device, a welding quality judgment device used for the welding device, and a structure of the welding device for performing welding quality judgment. Background technique [0002] In the manufacturing process of a semiconductor device, a wire bonding apparatus is often used that connects pads serving as semiconductor chip electrodes and leads serving as lead frame electrodes with wires that are thin metal wires. Most of the wire welding devices are equipped with a welding arm driven by a drive motor, an ultrasonic mold (horn) installed on the welding arm, a capillary installed on the front end of the ultrasonic mold, and an ultrasonic vibrator installed on the ultrasonic mold to drive the welding arm to rotate, so that the capillary Relative to the welding point or the pin moves along the direction of connection and separation, the initial ball formed at the front end of the capill...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/607
CPCH01L2924/01015H01L2224/85205B23K2201/42H01L2924/01082H01L2224/78301H01L2924/00014H01L2924/01047H01L2924/01004H01L24/85H01L2224/789H01L2924/01005H01L2924/01033H01L2924/01006H01L24/78B23K20/007H01L2924/014B23K31/125B23K2101/42H01L2224/451H01L2224/48H01L2924/00H01L2224/45099H01L2224/05599
Inventor 青柳伸幸濑山耕平
Owner SHINKAWA CO LTD
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