Chip card having a plurality of components
A chip card and component technology, applied in the field of chip cards, can solve the problems of manufacturing cost and complexity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0031] figure 1 A layer structure for a smart card 10 is shown, which has a connecting conductor layer 11 which is arranged as an intermediate layer between an upper component layer 12 and a lower component layer 13 . In the case of the present exemplary embodiment, the connecting conductor layer 11 and the component layers 12, 13 have substrates 14, 15 and 16 formed from polyvinyl chloride (PVC) and polycarbonate (PC), which are used to manufacture the smart card 10 In a lamination process known per se, they are planarly connected to one another and thus constitute a card body 17 formed by a layer composite, as in Figure 1A shown in .
[0032] exist figure 1 In the exemplary embodiment shown in , the upper component layer 12 has a display device 18 embodied here as a "segment display" and keys 19, which are formed via connecting conductor structures 20 formed in the connecting conductor layer 11. Contact is made with the chip 21 and the battery arrangement 22 , which are ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 