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Chip card having a plurality of components

A chip card and component technology, applied in the field of chip cards, can solve the problems of manufacturing cost and complexity

Active Publication Date: 2015-07-15
LINXENS HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In fact, the complexity of the connecting conductor structure in the card body and the variations in the layer design resulting from the different operating properties of the chip card lead to corresponding manufacturing outlay and thus associated costs

Method used

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  • Chip card having a plurality of components
  • Chip card having a plurality of components
  • Chip card having a plurality of components

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Experimental program
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Embodiment Construction

[0031] figure 1 A layer structure for a smart card 10 is shown, which has a connecting conductor layer 11 which is arranged as an intermediate layer between an upper component layer 12 and a lower component layer 13 . In the case of the present exemplary embodiment, the connecting conductor layer 11 and the component layers 12, 13 have substrates 14, 15 and 16 formed from polyvinyl chloride (PVC) and polycarbonate (PC), which are used to manufacture the smart card 10 In a lamination process known per se, they are planarly connected to one another and thus constitute a card body 17 formed by a layer composite, as in Figure 1A shown in .

[0032] exist figure 1 In the exemplary embodiment shown in , the upper component layer 12 has a display device 18 embodied here as a "segment display" and keys 19, which are formed via connecting conductor structures 20 formed in the connecting conductor layer 11. Contact is made with the chip 21 and the battery arrangement 22 , which are ...

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PUM

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Abstract

The present invention relates to a chip card and a method for the production of a chip card having a chip (21) which is arranged in a card body, and having a plurality of components (18, 19, 22) being electrically conductively connected to the chip by means of a conductor arrangement (20), wherein the card body is composed of a plurality of substrate layers (11, 12, 13) which are arranged in a layer structure, wherein the components and the conductor arrangement are arranged in different substrate layers, specifically a component layer arrangement and a connecting layer arrangement, and have contact surfaces (23, 24, 25, 26, 31, 32, 33, 34), which are disposed so as to overlap one another, for producing an electrically conductive contacting.

Description

technical field [0001] The invention relates to a chip card having a chip arranged in a card body and a plurality of components electrically conductively connected to the chip by means of connecting conductor structures, wherein the card body consists of a plurality of substrate layers arranged in a layer composite. Furthermore, the invention relates to a method of manufacturing a chip card. Background technique [0002] Smart cards of the type mentioned at the outset are known in different embodiments, which differ in particular due to the type and number of components contained in the smart card. For example, it is known to form such a chip card as a so-called "active" card, which has an integrated power supply unit in the card body, such as a battery, which is electrically conductively connected to the chip by means of connecting conductors and is the chip And, for example, a display device provided outside the chip and inside the card body provides the required operatin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
CPCG06K19/07745H01L2924/0002G06K19/07718G06K19/07703H01L2924/00
Inventor 曼弗雷德·里茨勒尔雷蒙德·弗里曼
Owner LINXENS HLDG