Radiating module combined in interference fit

Abstract

The invention relates to a radiating module combined in interference fit, which is particularly suitable for providing the configuration of notebook computer and comprises more than one sheet type heat conducting pedestal, more than one heat conducting pipe and a radiating fin set, or a radiating fan is combined at the radiating fin set; the sheet type heat conducting pedestal is provided with a groove having a clamping convex part so that the heat absorbing end of the heat conducting pipe is embedded to form matched combination and stable combination between the heat absorbing end of the heat conducting pipe and the groove; the radiating end of the heat conducting pipe passes through or is embedded in the radiating fin set to realize the effect of interference fit integrally; an embedding groove is formed adjacent to the radiating fin set; the fixed sheet of the radiating fan is provided with a bending sheet at an air outlet, can be quickly embedded through the bending sheet, and is locked at the embedding groove of the radiating fin set; therefore, the lock joint between the radiating fan and the radiating fin set is realized so that the integral combination of the radiating module is simplified.

Description

technical field [0001] The present invention relates to a heat dissipation module design that is closely matched, which is especially suitable for notebook computers. In order to make the heat conduction base, heat conduction pipe and heat dissipation fin group, or the heat dissipation fan included, all can be quickly and stably Complete tight fit bond. Background technique [0002] It is known that electronic components such as the central processing unit (CPU), north-south bridge chips, or display chips used in notebook computers will emit high heat during operation. Make sure it works stably. [0003] The above-mentioned conventional heat dissipation module usually includes: a heat conduction base, a heat conduction pipe, and a heat dissipation fin set or a combined heat dissipation fan, which mainly opens a groove (or through hole) on the heat conduction base, and absorbs heat through the heat conduction Embedding (or penetrating) the end of the groove (or through hole...

AI Technical Summary

Problems solved by technology

[0003] The above-mentioned conventional heat dissipation module usually includes: a heat conduction base, a heat conduction pipe, and a heat dissipation fin set or a combined heat dissipation fan, which mainly opens a groove (or through hole) on the heat conduction base, and absorbs heat through the heat conduction Embedding (or penetrating) the end of the groove (or through hole), and then welding or penetratingly combining the heat dissipation end of the heat pipe with the heat dissipation fin group; the heat conduction base of the aforementioned conventional heat dissipation module is a rectangular block with a thickness, It has a certain volume weight, and the inner surface of the groove (or through hole) of the heat conduction base is smooth, and the outer wall of the heat conduction pipe is also relatively smooth. Therefore, the heat conduction pipe The stability of the combination of the heat sink and the heat transfer base is not ideal, so that the heat sink of the heat pipe often moves and loosens, resulting in poor contact, and the heat of the component cannot be effectively transferred to the heat dissipation fin group, so the overall composition is easy Lead to defective products or poor delivery efficiency

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