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Optoelectronic device submount

A technology for encapsulating bases and photoelectric components, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., and can solve problems such as circuit damage

Active Publication Date: 2014-03-12
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some cases, it is not possible to incorporate the circuit into the LED chip because the solder reflow technique can lead to circuit damage

Method used

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  • Optoelectronic device submount
  • Optoelectronic device submount
  • Optoelectronic device submount

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] According to a first embodiment, Figure 1A , 1B , 2, 3A and 3B show the packaging base 1 of the optoelectronic element. The top surface 5 is the mounting side of the package base, on which one or more optoelectronic components are mounted and disposed. The bottom surface 19 of the package submount 1 is the contact side to which one or more external electrical connections can be made. In some embodiments, the contact side 19 is also used to provide a thermal connection to the external environment or a heat sink (not shown) to reduce the temperature of the device. The top surface 5 of the package submount 1 is substantially parallel and opposite to the bottom surface 19 . Both the top surface 5 and the bottom surface 19 intersect four vertical side walls 4 in a single monolithic element.

[0036] Such as Figure 1A and 3A As shown, the top surface 5 includes planar landing pads 7 . The landing pads 7 establish an area on which optoelectronic components can be placed...

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PUM

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Abstract

A submount for an optoelectronic device includes a substrate, a first top pad on a top surface of the substrate, a first bottom pad on a bottom surface of the substrate and a first wrap-around contact in a sidewall recess of the substrate, in which the first wrap-around contact is coupled electrically to the first top pad and to the first bottom pad. Alternatively, or in addition, the submount includes a device mounting pad on the top surface of the substrate, a wire-bond pad on the top surface of the substrate, a contact pad on the bottom surface of the substrate and a feedthrough contact which extends through the substrate and electrically couples the wire-bond pad to the contact pad.

Description

technical field [0001] The present disclosure relates to optoelectronic device submounts. Background technique [0002] Optoelectronic elements, such as light emitting diodes (LEDs), are used in many applications. For example, light-emitting diodes are commonly used in consumer electronics components, such as flash devices in mobile camera phones. In some cases, light emitting diodes can be used as backlights for notebook computer displays. In other examples, light emitting diodes are used in brake lights, headlights, or cabin lights in automobiles. [0003] In conventional LED packages, the LED chip is placed on a package base, which enables electrical connections to the LED chip. In order to accommodate different types of LED chips, many package submounts with various sizes, geometries, and electrical connections have been produced. However, there is no single submount design that can accommodate different LED chip designs. Furthermore, the existing package base of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/62
CPCH01L25/167H01L2224/48465H01L23/481H01L33/62H01L33/486H01L2224/48091H01L2924/00014
Inventor 汤玛士·墨菲
Owner EPISTAR CORP