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Method and system for packaging a MEMS device

A technology for external devices and auxiliary devices, applied in the process of producing decorative surface effects, microstructure devices, manufacturing microstructure devices, etc., can solve the degree of reducing the thickness of the display, limiting the strength and life, increasing the thickness and weight of the device. and cost issues

Inactive Publication Date: 2011-08-31
IDC LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the nature of LCDs, both the front and rear panels serve as active or functional components of the LCD, which limits the ability to combine, eliminate and / or replace layers with thinner layers to reduce overall display thickness Degree
Additionally, the active nature of these two panels of the LCD limits the materials that can be used for these panels, and thus limits the strength and lifetime of these panels
If additional strength and / or protection is required beyond what can be provided by using a material suitable for an LCD panel, layers of material other than the LCD's panel may be required, which may add to the device's Thickness, weight and cost

Method used

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  • Method and system for packaging a MEMS device
  • Method and system for packaging a MEMS device
  • Method and system for packaging a MEMS device

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Embodiment Construction

[0041] As discussed in more detail below, one embodiment of the invention is an interferometric modulator-based display in which the backplane includes active components. Typically, in an interferometric modulator, the backplate has a purely mechanical function. As a result, there are fewer restrictions on the materials that can be used for the backsheet and more freedom to combine, eliminate and / or replace multiple layers with alternative or thinner layers. Specifically, in this embodiment, the backplane may be used to house electronic circuitry for controlling the state of the interferometric modulators. For example, integrated circuits such as display driver chips can be mounted directly on the backplane and then electrically connected to the interferometric modulators. The backplane can also be used to provide structural support for a device enclosing the display. By using the backplane for multiple purposes, interferometric modulator based constructions can advantageous...

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Abstract

The invention relates to method and system for packaging a MEMS device. A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.

Description

[0001] Information about divisional applications [0002] This application is a divisional application of the Chinese invention patent application with the application number 200510102594.8; the application date is September 12, 2005; the invention title is "Method and system for packaging a MEMS device". technical field [0003] The technical field of the invention relates to microelectromechanical systems (MEMS). Embodiments of the invention relate to microelectromechanical systems (MEMS) and methods for packaging these systems. More specifically, the present invention relates to packaging an interferometric modulator using a backplane that also houses electronic circuitry connected to the modulator. Background technique [0004] Consumers generally want electronic products to be as small and light as possible. As flat-panel displays improve and become more widely available, it's no surprise that product size is driven by the size of the display, putting pressure on peo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B26/00B81C1/00
CPCG02B26/001B81C1/0023Y10T29/49002G02F1/21G09G3/3406
Inventor 马克·W·迈尔斯杰弗里·B·桑普塞尔洛朗·帕尔玛蒂尔布莱恩·W·阿巴克尔菲利浦·D·弗洛伊德
Owner IDC LLC