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Double-side packaging structure and wireless communication system applying the structure

A technology of packaging structure and sealing glue, which is applied in the direction of electrical components, electric solid devices, circuits, etc.

Active Publication Date: 2013-07-17
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, such an arrangement must consider electrical noise interference (Noise Interference)

Method used

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  • Double-side packaging structure and wireless communication system applying the structure
  • Double-side packaging structure and wireless communication system applying the structure
  • Double-side packaging structure and wireless communication system applying the structure

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Experimental program
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Embodiment Construction

[0013] refer to Figure 1 to Figure 6 , is a schematic diagram showing a manufacturing method of a packaging structure according to an embodiment of the present invention. refer to figure 1 , providing a substrate 10 . The substrate 10 has a first surface 101 and a second surface 102 , wherein the second surface 102 is opposite to the first surface 101 . In this embodiment, the substrate 10 further has several first pads 103 , 106 , several second pads 104 , at least one conductive layer 105 and at least one via 107 . The first pads 103 , 106 are adjacent to the first surface 101 of the substrate 10 , and the second pads 104 are adjacent to the second surface 102 of the substrate 10 . The conductive layer 105 is embedded in the substrate 10 , and the first pad 106 is electrically connected to the conductive layer 105 through the via 107 .

[0014] A second die 11 is attached to the second surface 102 of the substrate 10 using an adhesive layer 12 . Next, several wires 13 ...

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PUM

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Abstract

The invention relates to a double-side packaging structure, which comprises a base plate, at least a first electrical component, a second crystal grain, a barrier dam and a filler. The first electrical component abuts on a first surface of the base plate. The second crystal grain is located a second surface which is opposed to the first surface of the base plate. The barrier dam surrounds the second crystal grain. The filler is located in a space defined by the barrier dam and coats the second crystal grain. In this way, electrical noise interference in the second crystal grain and the first electrical component can be reduced. Furthermore, by means of the barrier dam and the filler, the second crystal grain can be protected.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure, in particular, to a semiconductor packaging structure with a double-sided packaging structure. Background technique [0002] The semiconductor industry is committed to making products that are thin, light and small. In particular, electronic products usually have to accommodate high-density electronic components in a limited space. In a conventional semiconductor package structure, several semiconductor components (eg, die and passive components) are placed on the surface of a substrate. Since these semiconductor components are arranged side by side, they occupy a relatively large space. Furthermore, such an arrangement must consider electrical noise interference (Noise Interference). For example, radio frequency components (RF Components) will have noise and interfere with digital baseband (Digital Baseband) or some sensitive analog components (Analog Component). Contents of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/52H01L23/31H01L21/50H01L21/56H01L21/60
CPCH01L2924/3025H01L2924/16153H01L2924/19106H01L2224/16225H01L2224/32225H01L2224/48227H01L23/552H01L2924/15311H01L2224/73265H01L2924/19105H01L24/73
Inventor 廖国宪蔡志青孙于翔陈子康史馥毓陈建成郑民耀
Owner ADVANCED SEMICON ENG INC