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Varnish-baking method of electronic device housing

A technology for electronic devices and housings, which is applied to devices for coating liquids on surfaces, pre-treatment surfaces, coatings, etc., can solve the problems of material and labor waste, high temperature tapes are expensive, etc., and achieve the effect of reducing the cost of baking paint

Inactive Publication Date: 2011-11-16
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of the high-temperature adhesive tape is equally expensive, and the high-temperature adhesive tape needs to be manually pasted on the housing of the electronic device
Like this, also can cause the waste of material and manpower

Method used

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  • Varnish-baking method of electronic device housing
  • Varnish-baking method of electronic device housing
  • Varnish-baking method of electronic device housing

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Experimental program
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Embodiment Construction

[0018] see figure 1 , an electronic device casing includes an outer cover 10 . The outer cover 10 includes a bottom plate 11 and two side plates 13 . In a preferred embodiment, the two side panels 13 are parallel to each other and perpendicular to the bottom panel 11 ; each side panel 13 is vertically bent inward with a folded edge 131 . The folded edge 131 is provided with a plurality of elastic pieces 1311 for preventing electromagnetic radiation. In a preferred embodiment, the outer cover 10 is substantially U-shaped.

[0019] The paint-baking method of the housing of the electronic device of the present invention solves the problem of paint spillage of the outer cover 10 during the paint-baking process by uniformly coating a chemical agent on the folded edge 131 . The chemical agent has the effect of antistatic shielding, and can turn into a gaseous state at 160°C to 220°C, and is in the form of an emulsion at a normal temperature, and has an ignition point greater than...

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PUM

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Abstract

A varnish-baking method of an electronic device housing is disclosed, which comprises the following steps: an edge of the electronic device housing is bent into an edgefold which is coated with a chemical agent; the electronic device housing then is placed on a varnish-baking hanger; varnish-spraying treatment is performed on the electronic device housing; the electronic device housing is placed in a baking oven so as to be baked, and simultaneously, the chemical agent on the edgefold is completely volatilized; and finally, the electronic device housing and the varnish-baking hanger are moved out of the baking oven.

Description

technical field [0001] The invention relates to a paint baking method for an electronic device housing. Background technique [0002] Among the existing mass-produced models, baking varnish is an important cost factor. In the paint-baking process of the U-shaped outer cover of the electronic device housing, in order to avoid paint overflow and anti-electromagnetic radiation bullet points from being covered by the paint layer, it is usually necessary to hang a jig on the area that cooperates with the side plate to prevent the electronic device housing from being damaged. Spilled paint during the paint baking process. In order to save costs, the industry has adopted high-temperature adhesive tape instead of fixtures. However, the price of the high temperature adhesive tape is also expensive, and the high temperature adhesive tape needs to be pasted on the housing of the electronic device manually. Like this, also can cause the waste of material and manpower. Contents of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D3/02B05D3/10
CPCB05D1/322B05D3/0254
Inventor 陈允隆刘忠杰徐翠
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD