Electronic component and manufacturing method thereof
A technology of electronic components and manufacturing methods, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, electrical components, etc., and can solve problems such as wiring groove defects, conductor plate deformation, etc.
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no. 1 approach
[0075] Figure 1 to Figure 2 It is a sectional view during the manufacturing process of the electronic component of this embodiment.
[0076] In this embodiment, a circuit board is manufactured as follows and used as an electronic component.
[0077] First, if figure 1 As shown in (a), an adhesive layer 12 is formed on a transparent support substrate 11 such as a glass substrate. Preferably, as the above-mentioned adhesive layer 12 , a UV tape whose adhesive force is weakened by irradiation of ultraviolet rays, a thermally foamed adhesive film whose adhesive force is weakened by heating, or the like is preferably used.
[0078] Next, a thermosetting resin or a thermoplastic resin is applied on the adhesive layer 12, and the first resin layer 13 made of the material is formed with a thickness of, for example, about 10 to 20 μm. However, this thickness is set according to the height of the convex pattern of the conductor plate mentioned later.
[0079] Thermosetting resins t...
no. 2 approach
[0100] Figure 3 to Figure 4 It is a sectional view during the manufacturing process of the electronic component of this embodiment. In addition, in these figures, the same reference numerals as those in the first embodiment are assigned to the same elements described in the first embodiment, and descriptions thereof will be omitted below.
[0101] like figure 2 As shown in (b), in the first embodiment, the circuit board 10 having one layer of the first conductor pattern 14z was produced, but in the present embodiment, a circuit board 10 having two layers of conductor patterns laminated is produced as follows: circuit substrate.
[0102] To manufacture such a circuit board, first, perform the process described in the first embodiment figure 1 (a)~ figure 2 The process of (a).
[0103] Next, if image 3 As shown in (a), the thermosetting second resin layer 17 is formed on the first resin layer 13 and the first conductor pattern 14z, respectively. Then, the second resin...
no. 3 approach
[0125] Figure 5 to Figure 7 It is a sectional view during the manufacturing process of the electronic component of this embodiment.
[0126] In the first and second embodiments, a circuit board is produced as an electronic component using a conductor plate, but in this embodiment, a conductor pattern is formed on a circuit board already prepared as follows.
[0127] First, if Figure 5 As shown in (a), one circuit board 30 is prepared on the surface of a resin base material 31 with an electrode pad 32 formed of a copper film or the like having a thickness of, for example, about 5 to 10 μm.
[0128] In addition, instead of the resin base material 31 , a build-up substrate in which a plurality of insulating layers and wiring layers are alternately formed may be prepared.
[0129] Next, if Figure 5 As shown in (b), by applying a thermosetting resin on the circuit board 30, the resin layer 33 is formed, for example, with a thickness of 10 to 20 μm. The material of the resin ...
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Abstract
Description
Claims
Application Information
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