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Chip Antenna And Antenna Device

An antenna and chip technology, applied in the directions of antennas, resonant antennas, antenna components, etc., can solve the problem of strong dependence on the resonant frequency of the antenna, and achieve the effect of miniaturization and frequency reduction.

Inactive Publication Date: 2014-04-02
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] But when figure 1 In the conventional chip antenna shown, the chip antenna 30 is mounted on a non-grounded area on the circuit board. However, since the resonant frequency of the antenna strongly depends on the positional relationship with respect to the ground electrode on the circuit board, it is different from the The resonant frequency of the chip antenna needs to be adjusted by changing the area of ​​the non-grounded area, such as other mounting parts or housings that are close to the mounting area of ​​the circuit board, and the surrounding environment of the chip antenna.
Therefore, there is a problem that the area of ​​the non-ground area cannot be fixed

Method used

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  • Chip Antenna And Antenna Device
  • Chip Antenna And Antenna Device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach 》

[0039] figure 2 (A) is a six-sided view of the chip antenna 101 of the first embodiment, figure 2 (B) is a perspective view of main parts of the antenna device 201 including the chip antenna 101, figure 2 (C) is an equivalent circuit diagram of the antenna device 201 .

[0040] The rectangular parallelepiped dielectric base 10 includes a lower surface (mounting surface on the circuit board), an upper surface, first and second side faces facing each other, and third and fourth side faces facing each other.

[0041] A power supply electrode 11 is formed from the lower surface of the dielectric base 10 to the upper surface via the fourth side surface. In addition, a passive electrode 12 is formed from the lower surface of the dielectric base 10 to the upper surface via the third side surface. The front ends (open ends) of the feeding electrode 11 and the non-power feeding electrode 12 face each other at a predetermined interval on the upper surface of the dielectric substra...

no. 2 approach 》

[0046] image 3 It is a six-sided view of the chip antenna 102 of the second embodiment.

[0047] The rectangular parallelepiped dielectric base 10 includes a lower surface (mounting surface on a circuit board), an upper surface, first and second side surfaces facing each other, and third and fourth side surfaces facing each other.

[0048] A power supply electrode 11 is formed from the lower surface of the dielectric base 10 to the upper surface via the fourth side surface. In addition, a passive electrode 12 is formed from the lower surface of the dielectric base 10 to the upper surface via the third side surface. The front ends (open ends) of the feeding electrode 11 and the non-power feeding electrode 12 face each other at a predetermined interval on the upper surface of the dielectric substrate 10 .

[0049] A frequency adjustment electrode 13 is formed on the second side surface of the dielectric substrate 10 . Ground electrodes 14 and 15 are formed from the lower sur...

no. 3 approach 》

[0052] Figure 4 It is a six-sided view of the chip antenna 103 of the third embodiment.

[0053] The rectangular parallelepiped dielectric base 10 includes a lower surface (mounting surface on a circuit board), an upper surface, first and second side surfaces facing each other, and third and fourth side surfaces facing each other.

[0054] A power supply electrode 11 is formed from the lower surface of the dielectric base 10 to the upper surface via the fourth side surface. In addition, a passive electrode 12 is formed from the lower surface of the dielectric base 10 to the upper surface via the third side surface. The front ends (open ends) of the feeding electrode 11 and the non-power feeding electrode 12 face each other at a predetermined interval on the upper surface of the dielectric substrate 10 .

[0055] A frequency adjustment electrode 13 is formed on the first side surface of the dielectric substrate 10 . In addition, a frequency adjustment electrode 16 is formed...

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PUM

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Abstract

A chip antenna and an antenna apparatus, which allow the resonance frequency of the antenna to be set with a high degree of freedom, include a feeding electrode formed on the bottom surface, fourth side surface, and top surface of a dielectric substrate, a non-feeding electrode formed on the bottom surface, third side surface, and top surface of the dielectric substrate, wherein the leading ends of the feeding electrode and the non-feeding electrode are facing each other with a predetermined distance therebetween on the top surface of the dielectric substrate. The chip antenna and antenna apparatus further include a frequency adjusting electrode formed on the first side surface of the dielectric substrate, and ground electrodes connected to ground electrodes of a circuit substrate on which the chip antenna is mounted, wherein the ground electrodes are electrically connected to the frequency adjusting electrode and are formed on the bottom surface of the dielectric substrate.

Description

technical field [0001] The present invention relates to a chip antenna and an antenna device including the same, and more particularly to a chip antenna and an antenna device in which feeding electrodes and non-feeding electrodes are arranged to face each other at a predetermined interval on a dielectric substrate. Background technique [0002] Patent Document 1 discloses a chip antenna in which feeding electrodes and non-feeding electrodes facing each other at predetermined intervals are formed on a dielectric substrate. figure 1 (A) is a six-sided view of the chip antenna shown in Patent Document 1, figure 1 (B) is its equivalent circuit diagram. [0003] Such as figure 1 As shown in (A), the power supply electrode 34 is formed from the lower surface of the rectangular parallelepiped dielectric substrate 31 to the upper surface via the fourth side surface. Likewise, a non-power supply electrode 36 is formed from the lower surface to the upper surface via the third side ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/50H01Q9/36H01Q9/40H01Q9/42H01Q13/08
CPCH01Q9/36H01Q1/2283H01Q13/08H01Q9/42H01Q9/40
Inventor 田中宏弥小村良山木知尚栉比裕一
Owner MURATA MFG CO LTD
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