Manufacture method for resin seal molding product and manufacture apparatus for resin seal molding product

A technology of resin sealing and manufacturing method, which is applied in the fields of manufacturing resin sealing molded products and manufacturing apparatuses of resin sealing molded products, and can solve problems such as deformation and damage of connectors.

Active Publication Date: 2012-03-21
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conversely, if the thickness of the connector in the vertical direction is large, the connector may be deformed or damaged by applying more than necessary mold clamping pressure to the connector with the upper and lower molding dies.

Method used

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  • Manufacture method for resin seal molding product and manufacture apparatus for resin seal molding product
  • Manufacture method for resin seal molding product and manufacture apparatus for resin seal molding product
  • Manufacture method for resin seal molding product and manufacture apparatus for resin seal molding product

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Experimental program
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Effect test

Embodiment approach 1

[0064] figure 1 It is a figure which schematically illustrates the resin-sealed molded product which can be manufactured using the resin-sealed molded product manufacturing apparatus or the resin-sealed molded product manufacturing method of this invention. figure 1 (A) is a plan view (above), figure 1 (B) is a side view. As shown in the figure, the resin-sealed molded product 10 is a resin-sealed molded product in which the outer surface of a substrate 11 on which electronic components are mounted is sealed and molded with a resin-sealed molded body 12 in which a resin material is cured. In addition, the pre-resin-sealed substrate 11 of the resin-sealed molded product 10 has an exposed substrate-exposing surface 13 . It does not specifically limit as the resin-sealed molded product 10, For example, a vehicle-mounted part is mentioned. The substrate exposed surface 13 preferably has, for example, good electrical contact and no sealing resin adheres thereto.

[0065] f...

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PUM

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Abstract

The present invention provides a resin seal molding method and an apparatus thereof for a substrate, which can perform resin seal molding on the outer surface portion of a glass epoxy substrate (11) and enable a portion of the substrate to be exposed out of a resin molding body. The method comprises the steps of performing resin seal molding on the outer surface portion of the glass epoxy substrate (11) by using a thermal curing epoxy resin (R) and the resin seal molding apparatus, enabling a portion of the substrate to be exposed to a portion of a mold structure (21, 22) outside a resin molding seal body, and enabling a resin deckle edge formation preventing component (23) to closely contact with the exposed surface (13) of the substrate. The resin seal molding apparatus is provided with the mold structure (21, 22) used for seal molding. Additionally, the top end of the resin deckle edge formation preventing component (23) is provided with a resin coating layer (23a).

Description

technical field [0001] The present invention relates to a method of manufacturing a resin-sealed molded product obtained by resin-sealing and molding a substrate on which electronic components are mounted, and to a manufacturing apparatus of the resin-sealed molded product. Background technique [0002] When resin sealing is performed on the outer surface of a connector mounted on a substrate, if the thickness (vertical dimension) of the connector in the vertical direction is small, it is difficult to apply the necessary mold clamping pressure to the connector with the upper and lower molding dies. . Therefore, there is a possibility that the resin material for sealing may leak out of the mold from the clamping surfaces (parting line surfaces) of the upper and lower molding dies. Conversely, if the thickness of the connector in the vertical direction is large, the connector may be deformed or damaged by applying more than necessary mold clamping pressure to the connector wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C33/38
CPCB29C33/12B29C33/40B29C33/56H01L21/56
Inventor 多根幸伴三好顺之
Owner TOWA
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