Manufacture method of dual-sided printed circuit board

Abstract

The invention discloses a manufacture method of a dual-sided printed circuit board, which comprises the following steps of: 1, drawing a dual-sided PCB (Printed Circuit Board) by using PCB auxiliary design software; 2, printing a top surface PCB drawing to an electronic picture file A; 3, printing a bottom surface PCB drawing to an electronic picture file B; 4, integrating the electronic picture file A and the electronic picture file B into a line symmetry electronic picture file C, then printing the electronic picture file C to heat transfer paper; 5, folding the heat transfer paper along a symmetrical line, placing a dual-sided copper-clad plate on the middle of the heat transfer paper; 6, respectively heat-transferring the top surface PCB drawing and the bottom surface PCB drawing to two sides of the dual-sided copper-clad plate by using a heat transfer method; and 7, corroding and drilling. Because the top surface PCB drawing and the bottom surface PCB drawing which are in line symmetry are printed on the heat transfer paper, thus the problem of misplacement of the upper surface and the lower surface in the traditional heat transfer process is solved. The manufacture method provided by the invention has the advantages of low cost and high speed.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacture. Background technique [0002] In the prior art, the development and use of small-batch circuits are mostly made by universal circuit boards or commissioned by professional printed circuit board manufacturers. Due to the characteristics of entrusting professional manufacturers to produce small batches of printed circuit boards in the development stage, it is time-consuming and expensive, resulting in a long development cycle. Therefore, the development of many small and medium-sized circuits focuses on the development of many small and medium-sized circuits. Thermal transfer method to make printed circuit boards. The production method described in this patent uses an electric iron to heat the transfer printing. Due to uneven heating and pressing, the quality of the thermal transfer printing is difficult to guarantee. Using a circuit board thermal transfer machine to transfer, the...

AI Technical Summary

Problems solved by technology

[0003] Using the thermal transfer printing method described in 200810066424.2 supplemented by a circuit board thermal transfer machine can produce a perfect single-sided panel, but when making a double-sided panel, since the top PCB and the bottom PCB are printed on the thermal For transfer paper, the top PCB diagram needs to be mirrored, and the bottom PCB diagram does not need to be mirrored. During the graphics transfer process, the upper and lower heat transfer papers are driven by different rubber rollers, which are easy to shift, resulting in transfer After printing, the top PCB and the bottom PCB are misaligned. Usually, the pads and vias of the double-sided board are dense, so it is difficult to successfully manufacture the double-sided board by the thermal transfer printing method.

Images