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Suspension board with circuit and producing method thereof

A suspension substrate and circuit technology, applied in the formation of electrical connections of printed components, configuration/installation of recording heads, instruments, etc., can solve problems such as the difficulty of compacting suspension substrates

Inactive Publication Date: 2012-05-09
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in this structure, since both the light-emitting element and the slider are mounted on the same surface of the metal support substrate, it is necessary to arrange the element-side terminal portion and the magnetic head-side connection terminal portion at a relatively high density, and the circuit board The compactness of the suspension board becomes difficult

Method used

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  • Suspension board with circuit and producing method thereof
  • Suspension board with circuit and producing method thereof
  • Suspension board with circuit and producing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0044] figure 1 It is a plan view showing the first embodiment of the suspension board with circuit of the present invention, figure 2 express figure 1 Bottom view of the suspension board with circuitry shown, image 3 yes means figure 1 A-A sectional view of the suspension board with circuit shown.

[0045] In addition, in figure 1 In the figure, the first insulating cover layer 14 (described later) is omitted in order to clearly show the relative arrangement of the first conductive pattern 13 (described later). In addition, in figure 2 In the figure, the second insulating cover layer 20 (described later) is omitted in order to clearly show the relative arrangement of the second conductive pattern 19 (described later).

[0046] Such as figure 1 As shown, the suspension board with circuit 1 is formed in the shape of a flat belt extending in the longitudinal direction, and integrally has a wiring portion 2 disposed on the other side (hereinafter referred to as the r...

no. 2 Embodiment approach

[0145] Figure 6 Showing a second embodiment of the suspension board with circuit of the present invention, it is a cross-sectional view of a slider mounting region.

[0146] In the first embodiment described above, the rear end portion of the second insulating base layer 18 is arranged so as to overlap the rear end portion of the first insulating base layer 12 when projected in the thickness direction, and the element-side terminal 22 is provided on the second base layer. the back side of the insulating layer 18, but in the second embodiment, such as Figure 6 As shown, the rear end portion of the second insulating base layer 18 is arranged to cover the through opening 36 of the metal supporting substrate 11 when projected in the thickness direction, and the element-side terminal 22 is arranged to penetrate the second insulating base layer 18 in the thickness direction. The mode is formed as a so-called flying lead.

[0147] In the second embodiment, when viewed from the fr...

no. 3 Embodiment approach

[0154] Figure 7 Showing a third embodiment of the suspension board with circuit of the present invention, it is a cross-sectional view of a slider mounting region.

[0155] In the above-mentioned first embodiment, the element-side terminal 22 is provided on the back surface of the second insulating base layer 18 so that the edge 46 thereof is substantially flush with the edge 45 of the second insulating base layer 18 . 3 In the embodiment, such as Figure 7 As shown, the element-side terminal 22 is formed as a so-called flying lead so as to protrude rearward from the rear end portion of the second insulating base layer 18 .

[0156] In the third embodiment, the element-side terminal 22 protrudes to the middle of the penetration opening 36 of the metal supporting board 11 when projected in the thickness direction.

[0157] In addition, when projected in the thickness direction, the through opening 36 exposed from the second insulating base layer 18 and the element-side termi...

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Abstract

The invention provides a suspension board with a circuit and a producing method thereof. The suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface of the metal supporting board, a second insulating layer laminated on a back surface of the metal supporting board, a first conductive pattern laminated on the surface of the first insulating layer and including a first terminal connected to the magnetic head, and a second conductive pattern laminated on the surface of the second insulating layer and including a second terminal. In a slider mounting region, the slider is mounted on the surface and an electronic element mounting space is formed. Respective end edges of the first and second insulating layers are spaced apart from and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed to face the electronic element mounting space.

Description

technical field [0001] The present invention relates to a suspension board with circuit, in particular, to a suspension board with circuit for a hard disk drive and a manufacturing method thereof. Background technique [0002] In recent years, a suspension board with circuit mounted with various electronic components has been known. As electronic components, for example, there are known light-emitting devices for improving the recording density by a light-assisted method, devices for inspection, for example, for inspecting the positional accuracy of a magnetic head, and the like. [0003] For example, in order to adopt the light-assisted method, there is known a suspension board with circuit having a metal support board, a light-emitting element mounted on the surface of the metal support board, and a slider. In this suspension board with circuit, the light-emitting element and The element-side terminal portion for electrical connection and the head-side connection terminal...

Claims

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Application Information

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IPC IPC(8): G11B5/58H05K3/40
CPCG11B5/486Y10T29/49032
Inventor 大泽彻也
Owner NITTO DENKO CORP
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