Moisture-proof film for electronic devices

A moisture-proof and relative humidity technology, applied in chemical instruments and methods, nanotechnology for materials and surface science, silicon compounds, etc., can solve problems that have not yet reached practical use

Inactive Publication Date: 2012-05-09
NAT INST OF ADVANCED IND SCI & TECH
View PDF7 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, clay films that can meet such requirements have not been

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Moisture-proof film for electronic devices
  • Moisture-proof film for electronic devices
  • Moisture-proof film for electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] (1) Production of modified clay

[0107] Natural purified bentonite, Kunipia F (manufactured by Kunimine Industry Co., Ltd.), was fully dried in an oven at a temperature of 110° C. or higher. 300 grams of this bentonite was added to a jar for a ball mill together with alumina balls. Next, 6 g of a silylation agent (Syra Ace S330 manufactured by Chitsuso Co., Ltd.) was added thereto, the inside of the tank was replaced with nitrogen, and ball milling was performed for 1 hour to obtain a modified clay.

[0108]As the silylation agent, a silylation agent having an amino group at the terminal is used. Add 24 grams of modified clay to 400 milliliters of a 0.5-regulated lithium nitrate aqueous solution, and vibrate to mix and disperse it. Vibration dispersion was performed for 2 hours to exchange the interlayer ions of the clay with lithium ions.

[0109] Next, the dispersion was subjected to solid-liquid separation by centrifugation, and the obtained solid was washed with...

Embodiment 2

[0124] (1) Preparation of clay paste

[0125] In the same manner as in Example 1, a lithium-exchanged modified clay was obtained. A clay pregel was prepared by adding and mixing 9 parts by weight of pure water to 1 part by weight of the modified clay, followed by boiling. The obtained gel was dispersed in dimethylacetamide using a homogenizer (ULUTRA TURRAX T50 manufactured by IKA Co., Ltd., shaft: S50N-G45F manufactured by the same company).

[0126] In a suitable container, put dimethylacetamide 35 times the weight of the clay (350 g), and add the clay pregel to it while stirring with a homogenizer. Stirring was continued for about 30 minutes at about 7000 rpm. After the homogenizer treatment, about 120 g of the dispersion liquid was divided into other containers. To this was added 4.76 g of polyimide varnish (U-Wunis A manufactured by Ube Industries, Ltd.).

[0127] Degassing was performed with a mixer in a mixing mode of 2000 rpm for 10 minutes and a defoaming mode of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Viscosityaaaaaaaaaa
Water vapor permeabilityaaaaaaaaaa
Tensile strengthaaaaaaaaaa
Login to view more

Abstract

Disclosed is a moisture-proof film for electronic devices, in which modified clay crystals are oriented and densely laminated, and the mechanical strength thereof is at a satisfactory level for use as a self-supporting film. The moisture-proof film comprises a modified clay and an additive, has a water vapor barrier property, and a water vapor permeability of less than 0.2 g/m2/day (at 40 DEG C and a relative humidity of 90%), wherein the modified clay is produced by a silylation reaction of a clay, the additive is a polyamide or a polyimide, and lithium ions make up at least 90 mol% of exchangeable ions in the modified clay. The moisture-proof film is a novel material that fulfils all of the requirement of weather resistance, gas barrier performance, water vapor barrier performance, flexibility, heat resistance, electrical insulation performance, and water resistance.

Description

technical field [0001] The present invention relates to a moisture-proof film for electronic devices, and more specifically, to a moisture-proof film for electronic devices that has flexibility, excellent water vapor barrier properties and gas barrier properties, and mechanical strength usable as a self-supporting film. The present invention provides new technologies and products related to moisture-proof films for electronic devices, which can be used as self-supporting films, for example, are chemically stable even at high temperatures exceeding 150°C, and can have gas-barrier properties , For example, it can be suitably used as the board|substrate for electronic devices, such as the substrate film for LCD, the film for LED, the back sheet of a solar cell, and a protective film. Background technique [0002] So far, moisture-proof films for electronic devices with excellent flexibility, gas barrier properties, and water vapor barrier properties have been manufactured based...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C01B33/40C08J5/18C08K9/06C08L77/00C08L79/08C09C1/42C09C3/12
CPCC01P2004/64C08J5/18B82Y30/00C01P2002/88C08L79/08C08L77/00C01P2006/22C01B33/44C08J2300/00C09C1/42
Inventor 蛯名武雄手岛畅彦石井亮南炫贞铃木麻实水上富士夫
Owner NAT INST OF ADVANCED IND SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap