106results about How to "Meet heat resistance" patented technology

The invention discloses high-temperature resisting methyl vinyl silicone rubber as well as a prescription and a preparation process thereof. The high-temperature resisting modified silicon rubber material which has more than 300 DEG C of application temperature and can not crack when according with requirements of 550 DEG C, 4mm distance and high-temperature radiation for more than 12 minutes is prepared by adopting the following steps of: adding cerium oxide and polymide into the prescription in which methyl vinyl silicon crude rubber is taken as a rubber raw material to improve the heat-resisting temperature, adding hydroxy silicone oil, dimethyl silicon oil and a silane coupling agent to improve the oil-resisting performance, adding precipitation method white carbon black and gas-phase method white carbon black to improve the tearing-resistance strength, adding quartz power and kieselguhr to improve the tensile strength and matching technical schemes of the preparation process. The high-temperature resisting methyl vinyl silicone rubber overcomes the problems and the defects of poor high-temperature and aging resistance performance and short service life of the common silicone rubber in the prior art, satisfies the special requirements for the heat-resisting performance, the electrical strength and the mechanical strength of automotive rubber products, and ensures that the silicone rubber products achieve the aims of improving the high-temperature resistance performance and prolonging the service life.

The invention discloses a double-layer coated essence microcapsule and a preparation method thereof. The essence microcapsule takes an oil soluble liquid essence as a capsule core, a gelatin modified amino resin composite material as a first-layer capsule wall and an acrylate polymer as a second-layer capsule wall, wherein a grafting transition area is formed by graft copolymerization of gelatin and acrylate between the first-layer capsule wall and the second-layer capsule wall. The preparation method comprises a step of prepolymer compounding, emulsification dispersion, microcapsule continuous double-layer coating and post-treatment. Compared with a single-layer coated microcaposule, the essence microcapsule has the advantages that the slow release performance, the heat resistance performance and the capsule wall material mechanical property are greatly improved, and the essence microcapsule can be used for most of microencapsulated essence products processed by heat extrusion molding of high molecular materials.

The invention relates to the field of highly dispersive all-bright acidic copper plating of printed circuit boards, in particular to a highly dispersive acidic copper plating additive and its preparation method and application. A highly dispersed acidic copper plating additive: at least one divalent sulfide main brightener, at least one polyethylene glycol or polypropylene glycol or both block copolymer polymer inhibitors, at least one alkyl quaternary ammonium salt Type cationic surfactant, 5‑50ml/L sulfuric acid, 0.1‑4ml/L formaldehyde. Its preparation method is to slowly add a specified amount of concentrated sulfuric acid into water, stir evenly and cool to room temperature, then sequentially add the inhibitor, surfactant, main brightener and formaldehyde into the sulfuric acid aqueous solution, stir until completely dissolved Concentrate to the final volume to obtain the highly dispersed acidic copper plating additive of the present invention. The high-dispersion acidic copper plating additive of the invention is especially suitable for electroplating through-holes with high thickness-to-diameter ratio of printed circuit boards, and can obviously improve the dispersion ability of the plating solution.

The invention discloses a fingerprint-resistant paint and a preparation method thereof. The fingerprint-resistant paint comprises the following components in parts by weight: 50-60 parts of acrylic resin emulsion (solid content is 45%), 5-8 parts of silicasol, 4-7 parts of mixed wax slurry, 0.2-1 part of defoaming and leveling agent, 4-6 parts of film-forming cosolvent and 30-40 parts of deionized water. The fingerprint-resistant paint takes water as the main solution, and is added with aqueous high-molecular organic substances which have superior properties and are harmless to human bodies. A low surface tension structure is formed on surface of the added filler and the paint film, thereby greatly enhancing the fingerprint resistance of the steel sheet. The fingerprint-resistant paint can be coated on the surface of a hot galvanized steel sheet or electrogalvanized steel sheet in a mode of dip coating, curtain coating, roller coating, gasket coating or the like, so that fingerprints can not be attached to the surface. In addition, the paint is environment-friendly.

The invention provides an extinctive PC/ABS (Poly Carbonate/Acrylonitrile Butadiene Styrene) plastic alloy which is prepared from the following components in percentage by weight: 30-50% of PC, 40-65% of ABS, 1-10% of compatilizer, 1-5% of flatting agent, 0.2-1% of lubricant and 0.2-1% of antioxidant. The extinctive PC/ABS plastic alloy provided by the invention has the advantages of low surface glossiness, good toughness and flowability, low cost and the like. The manufacturing method is simple in processing step and low in comprehensive cost and is especially suitable for the fields of electronics, home appliances, automotive trims and the like.

Belonging to the technical field of polymer composite materials, the invention relates to a polyether-ether-ketone wear resistant composite material, a preparation method and application thereof in mechanical polishing retaining rings. The polyether-ether-ketone wear resistant composite material is composed of, by mass percentage, 90-99.99% of polyether-ether-ketone resin and the balance coupling agent modified graphene oxide, and is prepared by a melt blending process. In order to improve the dispersibility of graphene oxide, the coupling agent is employed to perform surface treatment on graphene oxide. The polyether-ether-ketone wear resistant composite material prepared by the method provided by the invention has the characteristics of good wear resistance, high strength, high temperature resistance and the like, the processing technology is simple, the processing cost is low, and the polyether-ether-ketone wear resistant composite material meets the material requirement of mechanical polishing retaining rings. The material greatly reduces the processing cost of mechanical polishing retaining rings, and prolongs the service life of mechanical polishing retaining rings.

The present invention provides an alkali-developable photo curable and heat curable one-liquid solder mask composition and the printed circuit board using the composition, and the composition has the advantages of excellent coating film characters such as heat resisting property, closing property, non-electrolysis gold plating resisting property and the electrical characteristic, etc., and little fog. The invention provides a photo curable and heat curable one-liquid solder mask composition and the printed circuit board using the composition, and the composition includes the following components: (A) a carboxylated photo sensitive resin which is provided with more than two ethylenically unsaturated groups in one molecule and more than one carboxyl, and the acid strength pKa of the carboxyl is below 5.0; (B) a diluent; (C) a a photopolymerization evocating agent; (D) a cyanuramide or the organic acid salt; and (E) an inorganic filler.

It is an object to provide a novel laminating adhesive to thereby allow provision of a laminating adhesive composition for a laminate that provides good adhesion between a metal layer and a plastic layer, has satisfactory moisture barrier properties, heat resistance, insulation properties, durability, etc., also exhibits electrolyte resistance even after low-temperature curing, and does not undergo delamination over time. A laminate that uses the laminating adhesive composition and a secondary battery are also provided. The object is achieved by a laminating adhesive containing a non-chlorine-based polyolefin resin (A), an epoxy compound (B), and an organic solvent (C) including a cyclic alkane compound as an essential ingredient and further including an ester-based solvent or an alcohol-based solvent. In the organic solvent (C), the ratio, in parts by mass, of the cyclic alkane compound to the solvent other than the cyclic alkane compound is within the range of 1/1 to 20/1.

The invention relates to an organic silicone modified polyurethane/epoxy/acrylate composite emulsion and a preparation method thereof. The preparation method comprises three steps: a first step, synthesizing a low-molecular-weight epoxy prepolymer; a second step, preparing an organic silicone modified polyurethane, introducing the epoxy prepolymer into a polyurethane system, and terminating with hydroxyl, to prepare a polyurethane/epoxy composite prepolymer; and a third step, adding the prepolymer into an acrylate reaction system under a condition without addition of an emulsifier, carrying out a reaction with acrylic acid monomers under the action of an initiator, and thus preparing the organic silicone modified polyurethane/epoxy/acrylate composite emulsion. The prepared composite emulsion has excellent centrifugal stability, freeze-thaw stability and static stability; after film coating, the appearance is bright, clean and smooth, no bubbles and cracks exist, the tensile strength reaches 7-15 MPa, the elongation at break reaches 400-600%, a coating film has excellent weather resistance, the lowest decomposition temperature is 180 DEG C or more, and the surface contact angle is 70-95 DEG.

The invention discloses an epoxy resin composition which is prepared from novolac epoxy resin, isocyanic acid modified brominated epoxy resin, high-bromine epoxy resin, a phenolic resin curing agent, an epoxy resin curing accelerator, a heat stabilizer, inorganic filler and an organic solvent. A copper-clad laminate prepared by use of the epoxy resin composition disclosed by the invention has the characteristics of high glass transition temperature (higher or equal to 170 DEG C), good heat resistance and peel strength, good machinability and the like, and can meet the requirements for the heat resistance and processability of materials in a PCB (printed circuit board) processing process.

Disclosed is a moisture-proof film for electronic devices, in which modified clay crystals are oriented and densely laminated, and the mechanical strength thereof is at a satisfactory level for use as a self-supporting film. The moisture-proof film comprises a modified clay and an additive, has a water vapor barrier property, and a water vapor permeability of less than 0.2 g/m2/day (at 40 DEG C and a relative humidity of 90%), wherein the modified clay is produced by a silylation reaction of a clay, the additive is a polyamide or a polyimide, and lithium ions make up at least 90 mol% of exchangeable ions in the modified clay. The moisture-proof film is a novel material that fulfils all of the requirement of weather resistance, gas barrier performance, water vapor barrier performance, flexibility, heat resistance, electrical insulation performance, and water resistance.

The invention relates to a traditional Chinese herb residue filling non-weaving composite material and a preparation method which comprise a non-weaving base cloth material, the filling material traditional Chinese herb residues, thermal melting powders and curing agent, and the preparation method comprises: (1) the powders made from 3 percent to 80 percent of the traditional Chinese herb residues and 2 percent to 40 percent of the thermal melting powders is dispersed evenly on the non-weaving base cloth material; (2) the mixture obtained by the step (1) is put on a plate vulcanization machine so as to perform, and the thermal melting powders are melted, binded and cured with the pressure of 1 to and put on the plate vulcanization machine for curing and molding. The invention has the advantages of simple technique, short process, high efficiency and low cost. Meanwhile, the material has the antibacterial effect.

The invention relates to the field of high-dispersity full-bright acidic copper plating of printed wiring boards, and particularly relates to a high-dispersity acidic copper plating additive and a preparation method and application thereof. The high-dispersity acidic copper plating additive comprises at least one main divalent sulfide brightening agent, at least one polyethylene glycol or polypropylene glycol or polyethylene glycol and polypropylene glycol segmented copolymer inhibitors, at least one alkyl quaternary ammonium salt cationic surface active agent, 550ml/L of sulfuric acid, and 0.14ml/L of formaldehyde. The preparation method comprises the following steps: slowly adding concentrated sulphuric acid with specified volume to water; uniformly stirring; cooling to reach room temperature; then sequentially adding the inhibitor, the surfactant, the main brightening agent and formaldehyde to a sulphuric acid water solution; stirring until the materials are completely dissolved; and then metering the volume until the final volume is reached, thus obtaining the high-dispersity acidic copper plating additive. The high-dispersity acidic copper plating additive is particularly suitable for through hole electroplating with high thickness to diameter ratio of the printed wiring boards; and the dispersing capacity of the plating liquid can be obviously improved.

The invention belongs to the technical field of copper-clad plate production, and especially relates to a preparation method of a halogen-free CEM-1 copper-clad plate with a high peeling strength. Phosphor containing epoxy resin and bisphenol A type epoxy resin are taken as the main resin; phosphor containing linear phenolic resin is taken as the curing agent, polyfunctional epoxy resin is used to enhance the heatproof performance; a certain ratio of aluminum hydroxide is added to increase the electric tracking resistant index of the copper-clad plate; a nitrogen and phosphor containing fire retardant is added, and through the synergistic effect between nitrogen and phosphor, the fireproof performance of the copper-clad plate is enhanced and can reach the FV0 grade. By processing the surface of used filling material and controlling the particle size, the filling material can be evenly dispersed into resin glue to obtain uniform glue dipped sheets, the toughness of sheets is improved, the obtained copper-clad plate can reach the environment protection requirements and does not contain any halogen, the contents of chlorine and bromine are low, the peeling strength is high, the characteristic of resisting tracking caused by electric leakage is excellent, and CTI>=600V.

The invention discloses an overhead heat-resistance aluminum alloy conductor material and a preparation method thereof, and relates to the technical field of aluminum alloy conductor materials. The overhead heat-resistance aluminum alloy conductor material comprises the following elements in percentage by mass: 0.10-0.45% of zirconium, 0.01-0.10% of yttrium, 0.01-0.10% of scandium, 0.3-1.0% of lanthanum and cerium, 0.05-0.18% of iron, silicon not more than 0.05%, nickel not more than 0.05, magnesium not more than 0.02, zinc not more than 0.04, boron not more than 0.01, and the balance of aluminum and inevitable impurities. The preparation method comprises the following steps: foundry returns, aluminum ingots and Al-Fe intermediate alloy blanks are put in a smelting furnace, are heated for melting, and are transferred into an insulation furnace; then, Al-Zr, Al-Sc, Al-Y and Al-RE intermediate alloys are added for refining and deslagging to prepare fine alloy melts; a continuous casting and continuous rolling process is adopted to firstly pour the fine alloy melts as aluminum alloy castings; and the aluminum alloy castings are leaded into a rolling mill to roll aluminum alloy rods with needed specifications. The aluminum alloy conductor material is high in electric conductivity and excellent in high-temperature resistance; and the preparation method needs no heat treatment, saves the energy consumption, and reduces the production cost.

The invention provides heat-proof magnetic conveyor belt cover rubber. The cover rubber comprises the following components in parts by weight: 100 parts of ethylene propylene diene monomer rubber, 2-5 parts of anti-aging agent, 5-10 parts of zinc oxide, 2-8 parts of magnesium oxide, 1-3 parts of stearic acid, 25-50 parts of carbon black, 4-6 parts of dicumyl peroxide, 30-50 parts of asbestos fiber, 150-300 parts of magnetic powder, and 5-20 parts of paraffin oil. In addition, the invention further provides a preparation method of the heat-proof magnetic conveyor belt cover rubber. The heat-proof magnetic conveyor belt cover rubber meets the heat-proof property of high-temperature parts conveyed on an iron making and steel making production line, the heated aging damage rate of the conveyor belt can be reduced, and the service life of the conveyor belt can be prolonged; furthermore, metal parts falling on the conveyor belt can be effectively adsorbed, the slippage of the metal parts can be prevented, unnecessary damage can be reduced, the production of next procedure can be favorably carried out, and the working efficiency can be improved.

An adhesive film comprising a substrate and an adhesive layer on said substrate, said adhesive layer comprising: (A) a carboxyl group-containing (meth)acrylate polymer having a glass transition temperature (Tg) of 25 C or lower, said carboxyl group-containing (meth)acrylate polymer having a percent number of repeating units of 4.0 to 25% based on the total number of repeating units of the (meth)acrylate polymer; and (B) an amino group-containing (meth)acrylate polymer having a glass transition temperature (Tg) of 75 C or higher, said amino group-containing (meth)acrylate polymer having a percent number of amino group-containing repeating units of 3.5 to 15% based on the total number of repeating units of the (meth)acrylate polymer, wherein the ratio by weight of said component (A) to said component (B) is from 62:38 to 75:25.

The invention provides a radiation-sensitive resin composition, a cured film and a forming method thereof and a display element. The radiation-sensitive resin composition is excellent in both storage stability and low-temperature firing performance. Meanwhile, the radiation-sensitive resin composition is sufficient in radiation sensitivity. The curved film is excellent in heat resistance, chemical-corrosion resistance, transmittance, smoothness, voltage holding ratio and heat resistant linear expansion property. The radiation-sensitive resin composition is characterized by comprising [A] a polymer having epoxy groups, [B] a polymerizable compound having an ethylenic unsaturated bond, [C] a radiation-sensitive polymerization initiator, and [D] at least one compound selected from the following formula (1)-(3).

To provide a photosetting/thermosetting one-liquid type solder resist composite which has excellent storage stability and workability and is superior in heat resistance, adhesiveness, electroless gold plating resistnace, electroless tin plating resistance, and electric characteristic, and which can be developed by alkali, and to provide a printed wiring board using the same. The photosetting/thermosetting one-liquid type solder resist composite contains a copolymer-based resin (A) having a carboxyl group which is made by adding a copolymer comprised of an unsaturated monobasic acid (a), and a compound (b) having one unsaturated group in one or more kinds of molecules, with a compound (c) which has an alicyclic epoxy group and an unsaturated group together within one molecular; a diluent (B); a photopolymerization initiator (C); a melamine (D) or its organic acid salt; and an inorganic filler (E).

The invention relates to environmentally-friendly white halogen-free reinforced flame-retardant high-temperature nylon. The nylon comprises the following components in part by weight: 35 to 75 parts of high-temperature nylon resin, 4 to 25 parts of flame retardant, 0.1 to 0.5 part of auxiliary agent and 10 to 50 parts of reinforced material. The preparation method for the nylon comprises the following steps of: 1) drying; 2) mixing; 3) extruding; and 4) molding and pelletizing. The product has the advantages of high strength, high flame resistance, high size stability, high temperature resistance, environment friendliness and the like. An antioxidant can play a role in anti-oxidizing protecting, maintains the stability of materials of the product in production, and protects the flame retardant and the high-temperature nylon resin from oxidative discoloration and decomposition; and a nucleating agent and a lubricating agent can improve the fluidity of the product, speed up the cooling and the forming of the product, improve the production efficiency of the product in injection machining, and contribute to demoulding the products in the injection molding. The environmentally-friendly white halogen-free reinforced flame-retardant high-temperature nylon can be used in circuit breakers, socket connectors such as power connectors, storage card connectors and sockets, motor components, computers and auxiliary equipment thereof, electric products, household electric appliance and the like.

Disclosed is a coloring composition with satisfactory heat resistance, no discoloration, excellent developability, and no development residues on a substrate and pixels of other colors, providing, a coloring composition for a color filter including (A) a polymer having a dye skeleton and (B) an organic solvent, wherein the content of an unreacted monomer component having the dye skeleton which is capable of forming (A) the polymer having the dye skeleton is less than or equal to 1 mass % with regard to (A) the polymer having the dye skeleton.

Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.

It is an object to provide a composition used for formation of a coating film which simultaneously attains water repellency as well as heat resistance and light resistance.

The composition of the present invention includes an organosilicon compound (a) which has at least one trialkylsilyl group and has two or more hydrolyzable silicon groups, and a metal compound (b) in which at least one hydrolyzable group is bonded to a metal atom.