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Epoxy resin composition and preparation method thereof

A technology of epoxy resin and novolac epoxy resin, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problems of increasing PCB processing and manufacturing costs, toughness, peel strength and PCB processability And other problems, to achieve the effect of good peel strength, excellent heat resistance, and meet the requirements

Active Publication Date: 2014-05-14
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the basic development direction of the high Tg copper clad laminate materials used in the industry is mainly to use the phenolic curing system, which performs well in the heat resistance of the material, and can basically meet the various performance requirements of the PCB for heat resistance. , although this type of material has the advantages of heat resistance, the material has insufficient toughness, peel strength and PCB processability, because the material is too hard and too brittle and lacks toughness, which makes it relatively large in PCB processability. The problem, but also increase the cost of PCB processing

Method used

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  • Epoxy resin composition and preparation method thereof
  • Epoxy resin composition and preparation method thereof

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Effect test

Embodiment 1

[0055] 1. The mass percentage of solids in the epoxy resin composition is 66.5%, and the rest are organic solvents (such as propylene glycol methyl ether),

[0056] Among them, the formula of solid matter is shown in the following table (by weight)

[0057] raw material Solid weight (g) Novolac epoxy resin 20 Isocyanate Modified Brominated Epoxy Resin 15 High Brominated Epoxy Resin 8 Phenolic resin curing agent 23 2-Ethyl-4-methylimidazole (2E4MZ) 0.05 Heat stabilizers 2.5 Aluminum hydroxide 10 silica 20

[0058] 2. The preparation method of epoxy resin composition:

[0059] (1) Add 49 grams of organic solvent propylene glycol methyl ether into the stirring tank according to the above weight, turn on the stirrer at a speed of 600 rpm, and continue stirring for 30 minutes;

[0060] (2) Add novolac epoxy resin, isocyanic acid modified brominated epoxy resin, high bromine epoxy resin, phenolic resin and heat stabili...

Embodiment 2

[0068] 1. The mass percentage of solids in the epoxy resin composition is 65%, and the rest are organic solvents (such as propylene glycol methyl ether),

[0069] Among them, the formula of solid matter is shown in the following table (by weight)

[0070] raw material Solid weight (g) Novolac epoxy resin 25 Isocyanate Modified Brominated Epoxy Resin 14 High Brominated Epoxy Resin 6 Phenolic resin curing agent 22 2-Ethyl-4-methylimidazole (2E4MZ) 0.04 Heat stabilizers 2 Aluminum hydroxide 7 silica 22

[0071] 2. The preparation method of epoxy resin composition:

[0072] (1) Add 52 grams of organic solvent propylene glycol methyl ether into the stirring tank according to the above weight, turn on the stirrer, rotate at 600 rpm, and continue stirring for 30 minutes;

[0073] (2) Add novolac epoxy resin, isocyanic acid modified brominated epoxy resin, high bromine epoxy resin, phenolic resin and heat stabilizer in o...

Embodiment 3

[0081] 1. The mass percentage of solids in the epoxy resin composition is 62.3%, and the rest are organic solvents (such as propylene glycol methyl ether),

[0082] Among them, the formula of solid matter is shown in the following table (by weight)

[0083] raw material Solid weight (g) Novolac epoxy resin 30 Isocyanate Modified Brominated Epoxy Resin 12 High Brominated Epoxy Resin 10 Phenolic resin curing agent 27 2-Ethyl-4-methylimidazole (2E4MZ) 0.07 Heat stabilizers 1.3 Aluminum hydroxide 13 silica 17

[0084] 2. The preparation method of epoxy resin composition:

[0085] (1) Add 66 grams of organic solvent propylene glycol methyl ether into the stirring tank according to the above weight, turn on the stirrer at a speed of 600 rpm, and continue stirring for 30 minutes;

[0086] (2) Add novolac epoxy resin, isocyanic acid modified brominated epoxy resin, high bromine epoxy resin, phenolic resin and heat stabil...

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Abstract

The invention discloses an epoxy resin composition which is prepared from novolac epoxy resin, isocyanic acid modified brominated epoxy resin, high-bromine epoxy resin, a phenolic resin curing agent, an epoxy resin curing accelerator, a heat stabilizer, inorganic filler and an organic solvent. A copper-clad laminate prepared by use of the epoxy resin composition disclosed by the invention has the characteristics of high glass transition temperature (higher or equal to 170 DEG C), good heat resistance and peel strength, good machinability and the like, and can meet the requirements for the heat resistance and processability of materials in a PCB (printed circuit board) processing process.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and relates to an epoxy resin composition suitable for a lead-free high-Tg copper-clad laminate substrate material of high-density interconnection HDI and a preparation method thereof. Background technique [0002] Beginning on July 1, 2006, the official implementation of two EU directives (Restricting the Use of Hazardous Substances in Electrical and Electronic Products and Directives on Waste Electrical and Electronic Products) marks that the global electronics industry will enter the era of lead-free soldering. Due to the high soldering temperature, the thermal reliability of the copper clad laminate is correspondingly improved. The traditional lead-tin solder can no longer be used, and the soldering temperature required by today's tin-silver-copper and other alternative solders has been greatly increased. The traditional FR-4 copper clad laminate, due to its low heat resistance,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08K13/02C08K3/22C08K3/36C08K5/3445C08G59/62B32B15/092B32B27/04
Inventor 况小军席奎东朱建国粟俊华包秀银张东包欣洋
Owner NANYA NEW MATERIAL TECH CO LTD
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