This invention belongs to the field of
polymer materials technology, specifically relating to an
imide-structured photosensitive developing resin, its preparation method, and its application. The
raw material composition, by weight, includes: 2-6 parts
polyamine, 6-20 parts
dicarboxylic acid anhydride, 1-6 parts unsaturated monocarboxylic acid, 0.02-0.08 parts
polymerization inhibitor, 0.02-0.08 parts catalyst, 2-10 parts
hydrogen peroxide, 2-6 parts saturated
sodium bicarbonate solution, 1-5 parts
diethyl ether, 3-10 parts
formic acid, 50-70 parts N-methylpyrrolidone, and 2-8 parts
anhydrous zinc acetate. In this invention, the
polyamine is first reacted with an alicyclic
acid anhydride containing double bonds to generate a
polyimide structure with double bonds at the end groups. The double bonds are then epoxidized, followed by ring-opening esterification with an unsaturated monocarboxylic acid, and then modified with an anhydride to introduce carboxyl groups, ultimately obtaining the
imide-structured photosensitive developing resin. This resin has excellent electrical properties,
heat resistance, good dimensional stability, excellent adhesion, and low
dielectric constant, making it suitable for preparing IC substrate inks,
printed circuit board solder
resist inks, or
chip photoresists.