Photosensitive resin composition

A technology of photosensitive resin and composition, applied in optics, opto-mechanical equipment, instruments, etc., can solve problems such as excess carboxyl groups and PCT resistance becoming a problem

Inactive Publication Date: 2003-07-30
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the amount of hydroxyl groups, if the addition amount of saturated or unsaturated polybasic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0043] Examples and comparative examples are listed below to specifically describe the present invention. In addition, "part" and "%" mean weight unless otherwise indicated. Synthesis example 1 (synthesis example of photosensitive resin (A-1))

[0044] Add cresol novolak type epoxy resin (made by Dongdu Chemical Co., Ltd., EpotohtoYDCN-704, softening point 80 ℃, epoxy equivalent 210) 2100 parts (10 equivalents), acrylic acid 576 parts (8 moles), glycolic acid 152 (2 moles), 2.8 parts of methyl hydroquinone, 2097 parts of carbitol acetate, heated to 90 ° C, after confirming that the above mixture is uniformly dissolved, add 14.1 parts of triphenylphosphine, heated to 100 ° C, the reaction is about After 40 hours, a reaction product with an acid value of 0.5 KOHmg / g (12 equivalents of hydroxyl groups) was obtained. Add 301 parts of tetrahydrophthalic anhydride (1.98 moles (relative to 1 mole of the primary hydroxyl group in the synthesized reaction product (I), the ratio of te...

Synthetic example 2～8

[0045] The addition of cresol novolac type epoxy resin, acrylic acid, glycolic acid, methylhydroquinone, carbitol acetate, triphenylphosphine, tetrahydrophthalic anhydride in the synthetic example 1 is according to the table 1 or Table 2 is changed, and all the other are reacted in the same way as in Synthesis Example 1 to obtain photosensitive resins (A-2)~(A-5), (B-1)~(B- 3). Synthesis Example 9

Synthetic example 9

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[0048] Use a magnifying glass to visually judge the developability when the drying time is 20 minutes, 40 minutes, 60 minutes, 80 minutes, and 100 minutes. Evaluation was performed as follows. ◯: During development, ink was completely removed and development was possible. ×: At the time of development, there is still a place where no development occurs at all. (adhesion)

[0049] According to the test method of JIS D0202, draw small squares on the cured film, then stick the small squares with adhesive tape to peel off, and judge the peeled state with the naked eye. Evaluation was performed as follows. ◯: None were peeled off. Δ: The crossed portion was slightly peeled off. X: The coating layer was peeled off. (solder heat resistance)

[0050] According to the test method of JIS C6481, soak the test piece in the solder solution at 260°C for three times, each time for 10 seconds, and then observe the change of its appearance. Evaluation was performe...

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PUM

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Abstract

A photosensitive resin composition according to the invention includes (A) a photosensitive resin, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) a polymerizable unsaturated compound and/or a solvent, which photosensitive resin (A) is obtained by allowing an epoxy resin (a) to react with a compound (b) having one primary alcoholic hydroxyl group and one functional group selected from a carboxyl group and a secondary amino group per molecule and an unsaturated monobasic acid (c) to yield a reaction product (I) and allowing a saturated or unsaturated polybasic acid anhydride (d) to react with the reaction product (I). The photosensitive resin composition of the invention is used as a solder resist in printed circuit boards, can be satisfactorily developed in a dilute basic aqueous solution and can yield a cured film that is excellent in flexibility, water resistance, adhesion, solder heat resistance, electroless gold plating resistance and pressure cooker test (PCT) resistance.

Description

field of invention [0001] The present invention relates to a photosensitive resin composition, which is used as a solder resist for printed circuit boards, has excellent developability in dilute alkaline aqueous solution, and has excellent flexibility, water resistance, and adhesion of the cured coating , Solder heat resistance, electroless gold plating resistance and PCT (pressure cooker test) resistance and other excellent performance. Background of the invention [0002] In the past, the method of forming resist patterns on printed circuit boards was mostly the method of screen printing, but at present, considering the production efficiency, the photosensitivity that can be developed with dilute alkali solution described in the Japanese Patent Publication No. 1-54390 is adopted. resin. This photosensitive resin is made by reacting unsaturated monobasic acid-acrylic acid with novolak type epoxy resin, and then reacting saturated or unsaturated polybasic acid anhydride wit...

Claims

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Application Information

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IPC IPC(8): C08G59/56G03F7/038H01L23/498H05K3/28
CPCG03F7/0388H01L2924/0002H01L23/49894G03F7/027C08G59/182C08L67/00C08L63/10H05K3/287C08K5/0025C08L63/00C08G59/1438C08L2666/22H01L2924/00
Inventor 高木徹齐藤健矢田光广
Owner SHOWA DENKO KK
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