Radiation-sensitive resin composition, cured film, method for forming cured film, and display element

A technology of resin composition and radiation, which is applied in the fields of electrical components, nonlinear optics, semiconductor/solid-state device manufacturing, etc., can solve the problems of reduced storage stability, and achieve excellent low-temperature firing, excellent storage stability, and heat-resistant linearity Excellent expansion effect

Active Publication Date: 2011-12-07
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, adding a general amine compound will cause a time-dependent reaction with the epoxy group present in the composition, and the storage stability will decrease

Method used

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  • Radiation-sensitive resin composition, cured film, method for forming cured film, and display element
  • Radiation-sensitive resin composition, cured film, method for forming cured film, and display element
  • Radiation-sensitive resin composition, cured film, method for forming cured film, and display element

Examples

Experimental program
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Effect test

preparation example Construction

[0149]

[0150] The radiation-sensitive resin composition of the present invention can be prepared by combining [A] polymer or [A] copolymer, [B] polymerizable compound, [C] polymerization initiator and [D] compound, and without damaging the desired Within the range of the effect, the optional ingredients added as needed are mixed and prepared in a prescribed ratio. This radiation-sensitive resin composition is preferably dissolved in an appropriate solvent and used in a solution state.

[0151] As a solvent for preparing the composition, it is possible to use a solvent capable of uniformly dissolving or dispersing [A] polymer or [A] copolymer, [B] polymerizable compound, [C] polymerization initiator, [D] compound and any Select components, and solvents that do not react with each component. Examples of such solvents include the same ones as those exemplified as solvents that can be used to synthesize the above [A] copolymer, and preferably contain at least one solvent sele...

Synthetic example 1

[0193] In a flask with a condenser and a stirrer, 5 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 220 parts by mass of diethylene glycol ethyl methyl ether were added. Next, add 20 parts by mass of styrene, 12 parts by mass of methacrylic acid, 28 parts by mass of dicyclopentanyl methacrylate and 40 parts by mass of glycidyl methacrylate, replace with nitrogen, and slowly stir while raising the temperature of the solution. Up to 70°C, the temperature was maintained for 5 hours to carry out polymerization to obtain a solution containing the copolymer (A-1). The solid content concentration of the obtained copolymer solution was 31.3%, and Mw of the copolymer (A-1) was 12,000. In addition, the solid content concentration refers to the ratio of the copolymer mass to the total mass of the copolymer solution.

Synthetic example 2

[0195] In a flask with a condenser and a stirrer, 5 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 220 parts by mass of diethylene glycol methyl ethyl ether were added. Then, add 10 parts by mass of styrene, 12 parts by mass of methacrylic acid, 23 parts by mass of tricyclic dicyclopentanyl methacrylate and 20 parts by mass of glycidyl methacrylate, 20 parts by mass of 2-methyl shrinkage methacrylate Glyceride, 10 parts by mass of tetrahydrofurfuryl methacrylate, after nitrogen replacement, further add 5 parts by mass of 1,3-butadiene, and slowly stir while raising the temperature of the solution to 70°C, and keep the temperature After 5 hours, polymerization proceeded to obtain a solution containing a copolymer (A-2). The solid content concentration of the obtained copolymer solution was 31.5%, and the Mw of the copolymer (A-2) was 10,100.

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Abstract

The invention provides a radiation-sensitive resin composition, a cured film and a forming method thereof and a display element. The radiation-sensitive resin composition is excellent in both storage stability and low-temperature firing performance. Meanwhile, the radiation-sensitive resin composition is sufficient in radiation sensitivity. The curved film is excellent in heat resistance, chemical-corrosion resistance, transmittance, smoothness, voltage holding ratio and heat resistant linear expansion property. The radiation-sensitive resin composition is characterized by comprising [A] a polymer having epoxy groups, [B] a polymerizable compound having an ethylenic unsaturated bond, [C] a radiation-sensitive polymerization initiator, and [D] at least one compound selected from the following formula (1)-(3).

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition suitable as a material for forming a cured film such as an interlayer insulating film, a protective film, or a spacer, a cured film formed from the composition, a method for forming a cured film, and a display element. Background technique [0002] In an electronic component such as a thin film transistor (TFT) type liquid crystal display element, an interlayer insulating film is generally provided to insulate interconnections arranged in layers. For example, a TFT type liquid crystal display element is manufactured through the process of forming a transparent electrode film on an interlayer insulating film, and then forming a liquid crystal alignment film thereon. Since the interlayer insulating film is exposed to high temperature conditions in the formation process of the transparent electrode film, or exposed to the resist stripper used in forming the electrode pattern, it is n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004G03F7/00G02F1/1333
CPCG03F7/0275H01L21/0273H01L21/0274
Inventor 米田英司西信弘儿玉诚一郎猪俣克巳
Owner JSR CORPORATIOON
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