Solder resist composition of light-curing single liquid style and printing circuit board use same

A printed circuit board, photocurable technology, used in printed circuits, printed circuit manufacturing, photosensitive materials for opto-mechanical equipment, etc. Electrolytic tin plating is resistant to plating, has not yet reached practical use, etc., and achieves high reliability.

Active Publication Date: 2006-07-12
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this one-component type solder resist has excellent handling properties, but its heat resistance and electroless gold plating resistance are not stable compared with two-component type liquid solder resists, and has not yet been put into practical use.
In addition, of course, it does not have electroless tin plating resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0039] The following examples and comparative examples are given to describe the present invention in detail, but the present invention is not limited to the following examples. In addition, the following so-called "parts" mean "parts by weight" unless otherwise specified.

Synthetic example 1

[0041] In a flask equipped with a thermometer, a stirrer, a dropping funnel and a reflux condenser, 300.0 g of dipropylene glycol monomethyl ether as a solvent was heated to 100°C, and 172.0 g of methacrylic acid, 172.0 g of methacrylic acid and 172.0 g of methacrylic acid were added dropwise over 3 hours. A mixture of ε-caprolactone-modified methacrylic acid (average molecular weight 344), 150.0 g of methyl methacrylate, 142.0 g of dipropylene glycol monomethyl ether, and 10.0 g of azobisisobutyronitrile as a polymerization catalyst, Then, it was stirred at 110° C. for 3 hours to deactivate the polymerization catalyst to prepare a copolymer resin solution. After cooling the resin solution, 170.0 g of 3,4-epoxycyclohexyl methacrylate (Saicroma-A400 from Daisel Chemical Co., Ltd.), 3.0 g of triphenylphosphine, and 1.3 g of hydroquinone monomethyl were added. base ether, the temperature was raised to 100°C, and the ring-opening addition reaction of epoxy was carried out with sti...

Synthetic example 2

[0043]In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, 276.0 g of dipropylene glycol monomethyl ether as a solvent and 8.0 g of azobisisobutyronitrile as a polymerization catalyst were added. Under a nitrogen atmosphere, it was heated to 80°C, and the monomers of 172.0 g of methacrylic acid, 100.0 g of methyl methacrylate, and 114.0 g of ethyl methacrylate were added dropwise and mixed for about 3 hours. After stirring for 1 hour, the temperature was raised to At 115°C, the polymerization catalyst was deactivated to obtain a copolymer resin solution.

[0044] After the resin solution was cooled to 85-95°C, 0.3 g of methylhydroquinone as a polymerization inhibitor and 2.0 g of triphenylphosphine as a catalyst were added, 160.0 g of glycerol methacrylate was slowly added dropwise, and the reaction was carried out for about 24 hours . The thus obtained co-clustered resin having two or more (meth)acryloyl groups and carboxyl groups in ...

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PUM

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Abstract

To provide a photosetting/thermosetting one-liquid type solder resist composite which has excellent storage stability and workability and is superior in heat resistance, adhesiveness, electroless gold plating resistnace, electroless tin plating resistance, and electric characteristic, and which can be developed by alkali, and to provide a printed wiring board using the same. The photosetting/thermosetting one-liquid type solder resist composite contains a copolymer-based resin (A) having a carboxyl group which is made by adding a copolymer comprised of an unsaturated monobasic acid (a), and a compound (b) having one unsaturated group in one or more kinds of molecules, with a compound (c) which has an alicyclic epoxy group and an unsaturated group together within one molecular; a diluent (B); a photopolymerization initiator (C); a melamine (D) or its organic acid salt; and an inorganic filler (E).

Description

technical field [0001] The present invention relates to an alkali-developable photo-curable / heat-curable single-liquid type solder resist composition suitable for use as a permanent mask for printed circuit boards, after exposure, by developing with an aqueous alkali solution to form an image, and By heating and curing, a solder resist film excellent in heat resistance, adhesion, electroless gold plating resistance, electroless tin plating resistance, and electrical properties can be formed. The present invention also relates to a printed circuit board using the above composition to form a solder resist pattern. Background technique [0002] From the viewpoint of high precision and high density, liquid alkali-developing type solder resists that form an image by developing after exposure and then heat and cure to form a coating film are used in almost all solder resists for printed wiring boards. As such an alkali-developable solder resist using a dilute aqueous alkali solut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004H05K3/00
CPCB21J13/02B21J13/14
Inventor 椎名桃子岩佐爱子二田完永野琢
Owner TAIYO INK MFG
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