Light solidifying/heat solidifying one-part welding resistant agent composition and printing circuit plate

A thermosetting and photocurable technology, applied in printed circuits, printed circuit manufacturing, photosensitive materials for opto-mechanical equipment, etc. High reliability and excellent storage stability

Active Publication Date: 2008-01-16
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there are the following problems in handling: the pot life after mixing is short, within 24 hours; in addition, between the drying process and the developing process, the carboxyl group contained in the active energy ray-curable resin of the main ingredient is related to the curing process. The epoxy group of the epoxy compound in the agent reacts slowly, resulting in poor development (hot fog), etc.
Generally, in order to increase the sensitivity, it is necessary to increase the amount of low-molecular-weight photopolymerizable monomers, but when the amount of such low-molecular-weight photopolymerizable monomers is increased, there is a problem that dryness to touch is significantly reduced

Method used

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Examples

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Embodiment

[0073] The present invention will be specifically described below by showing Examples and Comparative Examples, but the present invention is of course not limited to the following Examples. In addition, the following "parts" mean "parts by mass" unless otherwise specified.

Synthetic example 1

[0075] Add 660 g of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, soften Point 92°C, epoxy equivalent 220g / equivalent), 310.0g carbitol acetate, heated to 90°C and stirred to dissolve. Then, after cooling to 80°C, 216g of acrylic acid, 4.0g of triphenylphosphine, and 1.3g of methylhydroquinone were added and reacted at 90-100°C for 12 hours to obtain a reaction product with an acid value of 0.2mgKOH / g. Add 273.6g tetrahydrophthalic anhydride therein, be heated to 90 ℃, react about 8 hours, until the absorption peak (1780cm -1 )disappear. To this reaction liquid, 310.0 parts of aromatic solvent IPSOL#150 manufactured by Idemitsu Petrochemical Co., Ltd. was added, diluted, and taken out. The carboxyl group-containing photosensitive resin varnish thus obtained had a nonvolatile content of 65% and an acid value of solid matter of 87.5 mgKOH / g. Hereinafter, this reaction solution is referred to as A-1-1 varnish.

Synthetic example 2

[0077] Add 660 g of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, soften Point 92°C, epoxy equivalent 220g / equivalent), 284.3g carbitol acetate, heated to 90°C and stirred to dissolve. Then, after cooling to 80°C, 216g of acrylic acid, 4.0g of triphenylphosphine, and 1.3g of methylhydroquinone were added and reacted at 90-100°C for 12 hours to obtain a reaction product with an acid value of 0.2mgKOH / g. Add 180.0g succinic anhydride therein, be heated to 90 ℃, react about 8 hours, until the absorption peak (1780cm -1 )disappear. To this reaction liquid, 284.3 parts of aromatic solvent IPSOL#150 manufactured by Idemitsu Petrochemical Co., Ltd. was added, diluted, and taken out. The carboxyl group-containing photosensitive resin varnish thus obtained had a nonvolatile content of 65% and an acid value of solid matter of 95.5 mgKOH / g. Hereinafter, this reaction solution is referred to as A-1-2 varnish.

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PUM

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Abstract

The present invention provides an alkali-developable photo curable and heat curable one-liquid solder mask composition and the printed circuit board using the composition, and the composition has the advantages of excellent coating film characters such as heat resisting property, closing property, non-electrolysis gold plating resisting property and the electrical characteristic, etc., and little fog. The invention provides a photo curable and heat curable one-liquid solder mask composition and the printed circuit board using the composition, and the composition includes the following components: (A) a carboxylated photo sensitive resin which is provided with more than two ethylenically unsaturated groups in one molecule and more than one carboxyl, and the acid strength pKa of the carboxyl is below 5.0; (B) a diluent; (C) a a photopolymerization evocating agent; (D) a cyanuramide or the organic acid salt; and (E) an inorganic filler.

Description

technical field [0001] The present invention relates to an alkali-developable photocurable and heat-curable one-component solder resist composition useful for the production of printed wiring boards and a printed wiring board using the same, and more specifically, to a heat-resistant , Adhesiveness, electroless gold plating resistance, electrical properties and other coating properties, and alkali-developable photocurable and thermosetting one-component solder resist composition with less fog, and a printed wiring board using the same. Background technique [0002] Currently, from the standpoint of high precision and high density, the solder resist used in the manufacture of printed wiring boards is a liquid alkali-developed solder resist that forms an image by development after exposure, and heats and solidifies to form a coating film. As such an alkali-developing type solder resist using a dilute alkaline aqueous solution, for example, there has been proposed a two-compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/004H05K1/00H05K3/00
Inventor 椎名桃子岩佐爱子二田完永野琢
Owner TAIYO INK MFG
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