Polyamide acid resin having unsaturated group, photosensitive resin composition using same, and cured product thereof

A polyamic acid-based, unsaturated technology, applied in the field of photosensitive resin composition and its cured product, can solve the problems of insufficient flexibility, inability to cooperate with extreme bending, etc., and achieve the effect of excellent sensitivity

Inactive Publication Date: 2007-01-17
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using the material of Patent Document 2, although the crack resistance of the surface can be improved, it is not enough in terms of flexibility, and the problem is that it cannot cope with the related extreme bending.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] In a 3L flask equipped with a stirring device and a reflux tube, put: Epikote 828 (trade name: bisphenol A type epoxy resin manufactured by Japan Epoxy Resin Co., Ltd.) as a compound (e) containing at least 2 glycidyl groups in the molecule , Epoxy group equivalent: 186g / equivalent (theoretical value calculated by structural formula)) 372g (diepoxy group equivalent); Acrylic acid (molecular weight 72.06) as the monocarboxylic acid (f) containing ethylenically unsaturated group in the molecule 144.1g (2 moles); 1.55g of 2,6-di-tert-butyl-p-cresol as a thermal polymerization inhibitor; and 1.55g of triphenylphosphine as a reaction catalyst, reacted for 22 hours at a temperature of 100°C to obtain Unsaturated group polyol compound (c) (2 hydroxyl equivalents: theoretical value). Next, 1146 g of γ-butyrolactone as a solvent and 436.2 g (2 moles) of pyromellitic anhydride (manufactured by Nippon Catalyst Co., Ltd., molecular weight 218.12) as a tetrabasic dianhydride (d) wer...

Embodiment 2

[0105] Put in a 3L flask equipped with a stirring device and a reflux tube: 229.8 g of γ-butyrolactone as a reaction solvent; YX4000 (trade name: Nippon Cyclo Dixylenol type epoxy resin manufactured by Oxygen Resin Co., Ltd., epoxy equivalent: 196.0g / equivalent (theoretical value calculated by structural formula)) 392g (2 epoxy equivalents); 144.1 g (2 moles) of acrylic acid (molecular weight 72.06) of saturated monocarboxylic acid (f); 1.55 g of 2,6-di-tert-butyl-p-cresol as a thermal polymerization inhibitor; and triphenylphosphine as a reaction catalyst 2.30 g was reacted at a temperature of 100° C. for 22 hours to obtain an unsaturated group-containing polyol compound (c) (2 hydroxyl equivalents: theoretical value). Next, 936 g of γ-butyrolactone as a solvent was added to this resin; 436.2 g (2 moles) of pyromellitic anhydride (manufactured by Nippon Catalyst Co., Ltd., molecular weight 218.12) as a tetrabasic dianhydride (d), at 100° C. The reaction was carried out at hi...

Embodiment 3

[0108] In a 3L flask equipped with a stirring device and a reflux tube, put: 254.8 g of γ-butyrolactone as a reaction solvent; RE-203 (trade name : Bisphenol S-type epoxy resin manufactured by Nippon Kayaku, epoxy group equivalent: 225.3g / equivalent (theoretical value calculated from the structural formula)) 450.5g (2 epoxy group equivalents); 144.1 g (2 moles) of acrylic acid (molecular weight 72.06) of saturated monocarboxylic acid (f), 1.55 g of 2,6-di-tert-butyl-p-cresol as a thermal polymerization inhibitor; and triphenylphosphine as a reaction catalyst 2.55 g was reacted at 100° C. for 22 hours to obtain an unsaturated group-containing polyol compound (c) (2 hydroxyl equivalents: theoretical value). Then, 969.5 g of γ-butyrolactone as a solvent was added to this resin; 436.2 g (2 moles) of pyromellitic anhydride (manufactured by Nippon Catalyst Co., Ltd., molecular weight 218.12) as a tetrabasic dianhydride (d) was added at 100 The reaction was carried out at °C for 10 ...

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Abstract

The present invention provides a novel unsaturated group-containing polyamic acid resin (A) suitable for photosensitive resin compositions, and a photosensitive resin composition with excellent photosensitivity using the resin. The cured product obtained from the photosensitive resin composition has excellent Flexible, but also has excellent adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, etc. The unsaturated group-containing polyamic acid resin (A) is obtained by reacting an unsaturated group-containing polyester resin (a) with an anhydride group at the end and a compound (b) having 2 amino groups in the molecule. The resin composition is obtained by making it into the resin composition containing this unsaturated group containing polyamic-acid resin (A), a crosslinking agent (B), and a photoinitiator (C).

Description

technical field [0001] The invention relates to a photosensitive resin composition using unsaturated group-containing polyamide resin which can be developed in alkaline aqueous solution and its cured product. More specifically, it relates to solder resists for flexible printed circuit boards, interlayer insulating films for multilayer printed circuit boards, photosensitive optical waveguides, etc. that can provide image development, flexibility, adhesion, and solder heat resistance. , chemical resistance, plating resistance and other excellent cured photosensitive resin composition, and its cured product. Background technique [0002] At present, in the solder resists of some civil printed circuit boards and almost all industrial printed circuit boards, from the viewpoint of high precision and high density, after exposure by photolithography, images are formed by development processing, and further Under heat and / or light irradiation, the cured photocurable resin compositio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/16G03F7/027C08L79/08G03F7/037H05K1/03
CPCH05K1/0346C08G73/16C08L79/08G03F7/037H05K3/3452C08G69/00C08G69/36
Inventor 网岛千华田中龙太朗龟谷英照小柳敬夫
Owner NIPPON KAYAKU CO LTD
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