High-dispersity acidic copper plating additive and preparation method and application thereof

Abstract

The invention relates to the field of high-dispersity full-bright acidic copper plating of printed wiring boards, and particularly relates to a high-dispersity acidic copper plating additive and a preparation method and application thereof. The high-dispersity acidic copper plating additive comprises at least one main divalent sulfide brightening agent, at least one polyethylene glycol or polypropylene glycol or polyethylene glycol and polypropylene glycol segmented copolymer inhibitors, at least one alkyl quaternary ammonium salt cationic surface active agent, 550ml / L of sulfuric acid, and 0.14ml / L of formaldehyde. The preparation method comprises the following steps: slowly adding concentrated sulphuric acid with specified volume to water; uniformly stirring; cooling to reach room temperature; then sequentially adding the inhibitor, the surfactant, the main brightening agent and formaldehyde to a sulphuric acid water solution; stirring until the materials are completely dissolved; and then metering the volume until the final volume is reached, thus obtaining the high-dispersity acidic copper plating additive. The high-dispersity acidic copper plating additive is particularly suitable for through hole electroplating with high thickness to diameter ratio of the printed wiring boards; and the dispersing capacity of the plating liquid can be obviously improved.

Description

technical field [0001] The invention relates to the field of electroless plating solutions, in particular to a highly dispersed acidic copper plating additive and its preparation method and application. Background technique [0002] After decades of development in the printed circuit manufacturing industry, the manufacturing process has become increasingly complex, and the number of printed circuit boards with high build-up layers and high thickness-to-diameter ratios has gradually increased, and the requirements for the electrical interconnection process between layers are also getting higher and higher. The acidic copper plating additives used in general commercial applications can meet the copper thickness requirements of through-hole plating with low thickness to diameter ratio (≤6:1). When the thickness to diameter ratio of printed circuit boards is above 8:1, most acid plating Copper additives need to take measures such as reducing the current density, increasing the l...

AI Technical Summary

Problems solved by technology

However, the above measures will inevitably increase the energy consumption of the electroplating production line or reduce the production capacity of the electroplating line, increasing the manufacturing cost