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Protecting flip-chip package using pre-applied fillet

A fillet and wafer technology, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as increased risk

Active Publication Date: 2014-09-17
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lack of underfill at the corners of the die leads to an increased risk of delamination between the different layers in the die and between the die and the underfill

Method used

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  • Protecting flip-chip package using pre-applied fillet
  • Protecting flip-chip package using pre-applied fillet
  • Protecting flip-chip package using pre-applied fillet

Examples

Experimental program
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Embodiment Construction

[0031] The making and using of preferred embodiments of the invention are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the disclosure.

[0032] According to the embodiments, a novel package structure and its manufacturing method are provided. Intermediate stages in the manufacture of the examples are illustrated. Variations of the examples are then discussed. Like reference numerals are used to designate like elements throughout the various views and illustrated embodiments.

[0033] Figure 1A A top view of wafer 20 is shown. Wafer 20 includes a plurality of dies (also referred to in the art as chips) 22 and scribe lines 24 that space dies 22 from one another. The scribe line 24 includes a portio...

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PUM

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Abstract

A tube core has the first surface, the second surface opposite the first surface, and the side wall including the first and second parts. Compared with the second part, the first part is closer to the first surface.The first part of the side wall of the filled angle contact tube core is surrounded by the tube core.The workpiece is combined with the tube of the tube through the weld, the second surface is facing the workpiece.The gap between the filling tube and the workpiece of the first bottom, the first bottom filling tape contacted the filled angle, and the first bottom filling glue and the filled angle are formed by different materials.

Description

technical field [0001] The invention relates to a method for protecting a flip-chip package by using preset fillets and a device manufactured by the method. Background technique [0002] In integrated circuit packaging processes, the die may be bonded to the packaging substrate using flip chip bonding, where solder bumps are used to connect the bond pads on the die to the bond pads on the packaging substrate. After reflowing the solder bumps, the underfill is distributed in the gap between the die and package substrate. The underfill is then hardened, so the solder bumps are protected by the underfill. [0003] In traditional flip-chip packaging, underfill is filled into the gap between the die and package substrate by capillary underfill dispensing. As a result, depending on the viscosity of the underfill, the underfill is generally confined to the lower portion of the die sidewall if it ever climbs up the sidewall of the die, although some underfill may climb up the side...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/29H01L21/56
CPCH01L23/562H01L2224/26145H01L21/563H01L2924/10156H01L2224/83192H01L2224/83104H01L2224/73204H01L24/743H01L2224/92125H01L2224/32225H01L2224/81191H01L2224/16225H01L24/32H01L2224/27013H01L23/295H01L2924/14H01L2924/00012H01L2924/10155H01L2924/00H01L21/02013H01L21/02016H01L21/78H01L24/81H01L2224/81009
Inventor 蔡宗甫郭彦良许明松蔡侑伶陈承先普翰屏
Owner TAIWAN SEMICON MFG CO LTD