Buffer soles and shoes

A technology of studs and bottom surface, applied in the direction of soles, footwear, clothing, etc., can solve problems such as poor comfort, achieve the effect of strong starting and reduce the probability of foot injury

Active Publication Date: 2013-12-18
SHUANGCHI IND
View PDF15 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One problem with shoes with studs is poor comfort

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Buffer soles and shoes
  • Buffer soles and shoes
  • Buffer soles and shoes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] figure 1 and figure 2 The structure of the lower bottom surface of the cushioned shoe sole of the present invention is shown. Telescopic studs 1 are arranged on the forefoot part 2 of the buffer sole. The telescopic shoe spike 1 is an elastically expandable shoe spike with a built-in spring. The arrangement of the telescopic spikes makes the shoes of the present invention have the effect of buffering the impact force of the spikes on the feet, reducing the chance of foot injuries. Meanwhile, the elasticity of the telescopic spikes 1 can also help the wearer start running.

[0026] Figure 3 to Figure 5 One embodiment of the telescoping cleat structure of the present invention is shown. It can be seen from the figure that the retractable cleat includes a pointed piece 7 , a middle piece 8 and a spring 9 . Wherein, the pointed to...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides buffer soles and shoes, wherein stretchable spikes are arranged on the lower bottom surfaces of the buffer soles; and springs are arranged on the spikes. The shoes disclosed by the invention have higher comfort level, thus, the foot injury frequency is reduced.

Description

technical field [0001] The invention relates to a shoe sole and a shoe, in particular to a shoe sole with cushioning and a shoe using the shoe sole. Background technique [0002] The soles of some sports shoes are provided with studs to enhance the grip of the shoes. The representative of this type of shoes is football shoes. When the wearer (the person wearing the shoes, the same below) starts to run, he pedals hard on the ground, starts to accelerate or stops suddenly with the help of the frictional force fed back from the ground. When the ground is wet and slippery, sufficient frictional force cannot be fed back, which makes it impossible for the wearer to achieve a fast start or emergency stop. [0003] It is a common phenomenon that the ground is wet and slippery. In order to solve this problem, spikes protruding from the bottom surface are provided on the sole. When the wearer runs, the studs are easy to insert into the ground and generate a lot of grip (that is, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): A43B13/18A43B7/32
CPCA43C15/168
Inventor 陈文彪许松青
Owner SHUANGCHI IND
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products