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Device and method for testing temperature control based on temperature derating curve of modular power supply

A module power supply and temperature control device technology, applied in the field of communication, can solve the problems that the natural cooling module power supply test environment cannot be simulated more accurately, and the test power supply module cannot be reflected, so as to improve thermal adaptability, ensure stability and reliability high performance, reliability and stability

Active Publication Date: 2014-11-05
ZTE CORP
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Problems solved by technology

[0006] The present invention aims to provide a module power supply temperature derating curve test temperature control device and its method for testing temperature control, to solve the problem that in the related art, it is impossible to accurately simulate the natural cooling module power supply test environment, and it is also impossible to test the derating curve. Indicates the problem of testing the power module

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  • Device and method for testing temperature control based on temperature derating curve of modular power supply
  • Device and method for testing temperature control based on temperature derating curve of modular power supply
  • Device and method for testing temperature control based on temperature derating curve of modular power supply

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Embodiment Construction

[0031] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0032] Hereinafter, the present invention will be described in detail with reference to the drawings and examples. It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict.

[0033] As mentioned in related technologies, the derating test for natural cooling module power supply has always been a difficult point in the test. At present, the derating curve test is mainly carried out by controlling the ambient temperature. Only the ambient temperature is considered, but other factors will also be affected during the test. It affects the cooling process of the module power supply. According to this mode, it is impossible to accurately simulate the test environment of the natural cooling module power supply, and the derating curve canno...

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Abstract

The invention provides a device and a method for testing temperature control based on a temperature derating curve of a modular power supply. The device comprises a temperature cabinet, an environmental temperature controller and a substrate temperature controller, wherein the temperature cabinet is used for holding a modular power supply and carrying out heat preservation on the modular power supply; the environmental temperature controller is used for controlling the environmental temperature of the modular power supply, controlling the temperature cabinet to carry out cooling when the environmental temperature is higher than a preset temperature, and controlling the temperature cabinet to carry out temperature rise when the environmental temperature is lower than the preset temperature, wherein the environmental temperature refers to the internal temperature of the temperature cabinet; and the substrate temperature controller is used for controlling the substrate temperature of the temperature cabinet, controlling a substrate to carry out temperature rise when the substrate temperature is lower than a preset temperature and controlling the substrate to carry out cooling when the substrate temperature is higher than the preset temperature. By using the method and device disclosed by the invention, a test environment for naturally cooling a modular power supply can be precisely simulated.

Description

technical field [0001] The invention relates to the field of communications, in particular to a temperature control device for testing a module power supply temperature derating curve and a method for testing the temperature control. Background technique [0002] As the use environment becomes more and more complex, users put forward higher and higher requirements for the testing of module power supplies. Especially in the field of communication, due to the limitation of the environment and space, the power density of the overall equipment is getting larger and larger, the temperature range of the application environment is getting wider and wider, and the stability and reliability of the system work are getting higher and higher. For the environment of the module power supply The requirements for adaptability are constantly improving, and the requirements for the testing accuracy of the module power supply are also getting higher and higher. Usually, the derating curve of ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D23/19
Inventor 张啸宇秦方庆
Owner ZTE CORP
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