Single disc used for simulating heat consumption of IC (integrated circuit) chip

Abstract

The invention discloses a single disc used for simulating heat consumption of an IC (integrated circuit) chip, which relates to the field of communication. The single disc provided by the invention comprises a power supply module, a heat simulation module, a voltage stabilization module and an AD (analog-digital) converter module, a thermodetector, a serial port communication module, an MCU (microprogrammed control unit) control module, a temperature collecting sensor and a power collecting sensor; the heat simulation module, the voltage stabilization module and the AD converter module are respectively connected with the power supply module; the thermodetector is connected with the heat simulation module; the serial port communication module, the MCU control module, the temperature collecting sensor and the power collecting sensor are respectively connected with the voltage stabilization module; and the MCU control module is respectively connected with the serial port communication module, the temperature collecting sensor, the power collecting sensor and the AD converter module. According to the invention, heat consumption value of the IC chip can be simulated to provide foundation for IC chip heat dissipation design, single disc design and systematic heat dissipation design, so that the heat dissipation design risk brought by the only basis of software simulation and experience design can be reduced in the development process of the single disc and a whole machine, the design for a product can be more reasonable, and the success rate and the reliability of a system can be improved.

Description

technical field

[0001] The invention relates to the communication field, in particular to a single disk for simulating heat consumption of IC chips. Background technique

[0002] With the rapid development of information technology, the functions of communication equipment are continuously enhanced, and the use of highly integrated and high-power IC chips is becoming more and more common. While realizing system functions, reducing equipment size and power consumption can usually greatly improve product competitiveness and user experience. Therefore, equipment energy saving and compact design are very important aspects of product development. Among them, the heat dissipation of main IC chips problem appears to be particularly important. To reasonably solve the heat dissipation problem of the IC chip and the system, it is necessary to understand the heat consumption of the IC chip, and design the heat dissipation maximization according to the nominal power of the IC chip, whi...

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