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Microfabricated cylindrical fins for thermal management

A fin and column technology, applied in the field of bare fins with column fins, can solve problems such as increasing the package size

Active Publication Date: 2017-02-15
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the result of mounting the heat sink 112 to the package 100 may significantly increase the package size
Additionally, attaching a heat sink to conventional package 100 requires an additional step in the process of manufacturing and assembling the package

Method used

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  • Microfabricated cylindrical fins for thermal management
  • Microfabricated cylindrical fins for thermal management
  • Microfabricated cylindrical fins for thermal management

Examples

Experimental program
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Embodiment Construction

[0018] see figure 2 The exemplary embodiment shown in , provides an electronic package 200 with improved thermal management. Package 200 includes system board 202 and substrate 204 . Substrate 204 (which may be formed of silicon or other substrate material) may be coupled to system board 202 by solder balls 208, bumps, or any other coupling means. Die 206 may be electrically coupled to substrate 204 through flip chip bumps 212, and an underfill layer 210 may be added therebetween to enhance the reliability of the package.

[0019] Die 206 may be made of silicon or any other material used to fabricate a die. Die 206 may include front-end-of-line (FEOL) and back-end-of-line (BEOL) sections (shown simplified as a single layer 214 ). The FEOL section may include top layers for active devices, and the BEOL section may include multiple metal layers.

[0020] A plurality of cylindrical fins 220 extend outward from the rear surface of die 206 to improve thermal management of pack...

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PUM

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Abstract

An electrical package with improved thermal management. The electrical package includes a die with an exposed back surface. The package further includes a plurality of fins extending outwardly from the rear surface for dissipating heat from the package. The dies may be arranged in a multi-die stack configuration. In another embodiment, a method of forming a die for improved thermal management of an electrical package is provided.

Description

technical field [0001] The present invention relates generally to electronic packaging, and in particular, to dies with cylindrical fins for dissipating heat from the electrical packaging. Background technique [0002] In electronic packaging, chips continue to be made smaller but are required to perform larger functionality. However, as the chip performs more functions, more power is consumed and more heat is generated. Also, as the size of chips decreases, less surface area is required to dissipate the generated heat. For example, in a silicon chip, it can be difficult to control the silicon surface and junction temperature. [0003] In conventional packages, a heat sink is attached to the rear surface of the die using thermal glue. exist figure 1 In, for example, a conventional package 100 is shown. Package 100 includes a substrate 102 coupled to a system board 106 by a plurality of solder balls 108 . The area between the substrate 102 and the system board 106 also ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/48
CPCH01L23/367H01L23/3672H01L23/481H01L2224/16145H01L2224/16225H01L2224/32225H01L2224/73204H01L2225/06517H01L2225/06589H01L2225/06513H01L2225/06541H01L2225/06568H01L2924/10253H01L2924/00H01L21/50
Inventor 阿尔温德·钱德拉舍卡朗
Owner QUALCOMM INC