Measurement-based modeling method by prediction on electromagnetic emission broadband behavioral level of electronic component

Abstract

The invention discloses a measurement-based modeling method by prediction on an electromagnetic emission broadband behavioral level of an electronic component. The method comprises the following steps of: firstly carrying out active and passive judgments on a measured object, thus acquiring a port scattering parameter of the measured object; then performing vector fitting algorithm on the mapped port scattering parameter to acquire a state space model; and then converting the state space model into an SPICE (Simulation Program with Integrated Circuit Emphasis) circuit to be finally applied to circuit simulation. According to the invention, the modeling method by the prediction on the behavioral level can accurately establish an equivalent broadband model of the complicated electronic component by measuring data within a certain bandwidth or under fewer sampling points without relying on a simulation model provided by an electronic component manufacturer, and can achieve electromagnetic emission simulation on the circuit.

Description

technical field [0001] The invention relates to a predictive modeling method in the electromagnetic field, more particularly, to a measurement-based broadband behavior-level predictive modeling method for electromagnetic emission of electronic components. Background technique [0002] In recent years, people have paid more and more attention to electromagnetic compatibility. From the previous focus on the external launch of the system to the current focus on the underlying electromagnetic launch. However, in the past few years, the focus was often only on the wiring on the PCB (printed circuit board), the interconnection of the crystal oscillator, etc. In recent years, researchers have found that the electronic components on the circuit board will also generate electromagnetic interference. Improper control can also cause serious electromagnetic compatibility (EMC) problems. In electronic components, since the general working mechanism of active devices is relatively comple...

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Problems solved by technology

In electronic components, since the general working mechanism of active devices is relatively complex, it is the main source of electromagnetic interference. Previously, the modeling of electromagnetic emission of devices was mainly done by the designers of electronic components to simplify the circuit when they knew the internal circuit of the device. Then it is applied to PCB simulation, but this kind of modeling is unrealistic for users. The real method of establishing a device model based on measurement is the IBIS (Input / Output Buffer Information Specification) proposed in the 1990s. Model reference [Hobbs W; MuranyiA; Rosenbaum R IBIS: I / O buffer information specification, overview 1994], however, the IBIS model is only for input and output signals, and cannot meet the simulation requirements of electromagnetic compatibility

And for most users who care about the electromagnetic compatibility of electronic components, it is difficult to find the IBIS model of the electronic components used in most cases. Even if the IBIS model is obtained, it is often not enough for the study of electromagnetic compatibility

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