Method for measuring component height and device thereof

Abstract

The invention provides a method for measuring component height and a device thereof. The component height is measured by the following method comprising: projecting light patterns through an objective lens to a to-be-measured component placed on a placed surface in a direction perpendicular to the placing surface of a platform, wherein the placing surface is used for placing the to-be-measured component and can move along a height direction of the to-be-measured component, so that the platform is enabled to move sequentially in steps along the height direction of the to-be-measured component; shooting the to-be-measured component projected with the light patterns through the objective lens in accordance with the movement in steps, so as to obtain images of the light patterns; processing the images of the light patterns obtained through shooting the movement in steps of the platform, so as to obtain height information of each part of the to-be-measured component; and generating a height image or a image containing the height information of the to-be-measured component.

Description

technical field [0001] The present invention relates to a method and device for detecting the three-dimensional shape of an object, and in particular to a method for measuring the height of a component and its device, which can detect the height shape of an arbitrary object based on a plurality of images with different focus positions. The height information generates information necessary for scheduling of electronic component mounting equipment, and can provide the information to electronic component mounting equipment. Background technique [0002] Conventionally, many methods of detecting the height shape of an object from detected images have been proposed. In particular, there is a system described in Patent Document 1 regarding height measurement of components in electronic component mounting equipment. In this form, before mounting on the board, the electronic component held by the suction nozzle or the like is irradiated with line light from obliquely below, and th...

AI Technical Summary

Problems solved by technology

[0008] In the height measurement method described in Patent Document 1, since linear light is projected on the part from an oblique direction and the reflected light that changes according to the height of the part is detected, there is a limit in the detection range of the detector.

In addition, since the part is illuminated obliquely and the reflected light is detected, in the case of a concave part, an undetected part where the illumination cannot be projected and the reflected light cannot be detected occurs inside the part, and there is a problem that the shape of the entire part cannot be measured.

[0009] In addition, in Patent Document 2, according to the method of calculating the height of the component, the position of the pedestal is moved to the height of the component to obtain the focal length position of the camera, and a 3D image of the component is created. However, in this method, the position within the depth of focus of the camera All are detected as the same height, so tiny unevenness cannot be detected

Also, without specifying the method

Images