Stably-running variable-pitch clamp for reversing silicon wafers

Abstract

The invention discloses a stably-running variable-pitch clamp for reversing silicon wafers. The stably-running variable-pitch clamp comprises a top plate, a bottom plate, a frame formed by two lateral plates and multiple layers of silicon wafer placing plates located in the frame and capable of vertically sliding along the inner surfaces of the two lateral plates. The silicon wafer placing plates have thick portions and thin portions, the thickness of the thick portions is identical the height of small pitches, and gaps are formed at the positions of the thin portions of adjacent layers of silicon wafer placing plates. Two sides of the multiple layers of silicon wafer placing plates are further respectively provided with spacing gaskets fixed on an adjusting plate at intervals and corresponding to the positions of each layer of gaps. The sum of the thickness of the spacing gaskets and the thin portions of the silicon wafer placing plates is identical to the height of large pitches, and the length from the lower-layer spacing gaskets to top-layer spacing gaskets decreases progressively in an equal-difference mode layer by layer. In addition, the stably-running variable-pitch clamp further comprises a drive mechanism for driving the adjusting plate to enable the spacing gaskets to be inserted into or pulled out of the gap. The stably-running variable-pitch clamp for reversing the silicon wafers can quickly change a distance between every two silicon wafers and accordingly can quickly, half-stably and conveniently reverse the silicon wafers in two different pitch carrying tool rooms.

Description

technical field [0001] The invention belongs to the technical field of photovoltaic silicon wafer production equipment, and in particular relates to a stable-running variable-pitch jig for wafer rewinding in the photovoltaic silicon wafer production equipment. Background technique [0002] In order to improve the production capacity of photovoltaic silicon wafer diffusion process, it is the most convenient and widely used method to reduce the pitch of the silicon wafer carrier quartz boat (for example, from 4.76mm to 4.05mm) without changing the main equipment of the process. Before the diffusion process, the silicon wafer needs to be poured into the quartz boat from another carrier flower basket; after the process is completed, the silicon wafer needs to be poured into the flower basket from the quartz boat to transfer the silicon wafer to the next process. Because the transfer of silicon wafers between processes uses a flower basket of 4.76mm, when the pitch of the quartz ...

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Problems solved by technology

This method is inefficient, labor intensive, and the fragmentation rate is uncontrollable

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