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Mechanism to Mark Saw Die Orientation

A technology for cutting die and orientation, which is used in electrical components, electrical solid devices, circuits, etc.

Active Publication Date: 2016-01-13
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Determining the orientation of the chip (or die) before placing the mark is a challenge

Method used

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  • Mechanism to Mark Saw Die Orientation
  • Mechanism to Mark Saw Die Orientation
  • Mechanism to Mark Saw Die Orientation

Examples

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Embodiment Construction

[0031] Generally, the present invention relates to forming semiconductor devices on a substrate. It should be understood, however, that the following disclosure provides many different embodiments, or examples, for implementing different elements of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are of course merely examples and are not intended to be limiting. In addition, the present invention may repeat figure numbers and / or letters in various examples. This repetition is for brevity and clarity and does not in itself dictate a relationship between the various embodiments and / or structures discussed. Moreover, the formation of a first part on a second part in the ensuing description may include embodiments in which the first part and the second part are formed in direct contact, and may also include embodiments in which additional parts may be inserted between the first part and the second part...

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PUM

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Abstract

A mechanism for identifying the orientation of the saw die is provided. By forming the metal pattern in the corner stress relief region in one corner of the die different from the other corners, the user can easily identify the orientation of the die. The present invention also provides a mechanism to mark the orientation of the saw die.

Description

technical field [0001] The present invention generally relates to mechanisms for marking the orientation of a semiconductor die. Background technique [0002] Modern integrated circuits are often indeed composed of millions of active devices such as diodes and capacitors. These devices are initially isolated from each other, but are later connected together to form a functional circuit. Typical interconnect structures include horizontal interconnects such as metal lines (wires) and vertical interconnects such as vias and contacts. Interconnects are increasingly driving the performance limits and densities of modern integrated circuits. On top of the interconnect structure, bonding pads are formed and exposed on the top surface of the corresponding chip. Electrical connections are made through the bond pads to connect the chip to a packaging substrate or another die. The bond pads can be used for wire bonding or flip chip bonding. [0003] Flip-chip packaging uses bumps ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544
CPCH01L23/544H01L23/562H01L23/564H01L24/06H01L2223/5442H01L2223/54433H01L2223/54473H01L2223/54486H01L2223/54493H01L2224/02375H01L2224/0401H01L2224/05008H01L2224/05022H01L2224/05111H01L2224/05116H01L2224/05124H01L2224/05139H01L2224/05147H01L2224/05572H01L2224/06179H01L2224/13012H01L2224/13014H01L2224/13022H01L2224/13111H01L2224/13139H01L2224/13147H01L2224/73204H01L2924/00014H01L2924/12042H01L2924/014H01L2924/01082H01L2924/00012H01L2224/05552H01L2924/00
Inventor 陈宪伟
Owner TAIWAN SEMICON MFG CO LTD