Light-emitting diode lamp, its preparation method, housing in the lamp and its use
A technology of light-emitting diodes and lamps, applied in the direction of electric light sources, lighting and heating equipment, cooling/heating devices for lighting devices, etc.
Inactive Publication Date: 2016-09-28
DU PONT KK
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
While various structural configurations of LED luminaires have been disclosed, there remains a need for LED luminaires whose housings, due to their composition and component configuration, facilitate heat dissipation
Method used
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Examples
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Embodiment
[0146] These examples also illustrate the effect of the overmolded metal layer-resin layer structure of the LED housing described herein in releasing heat from the LED heat source by simulating the housing described herein and measuring the temperature at various distances from the simulated heat source. Heat dissipation at distance.
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The invention relates to a light emitting diode lamp, a manufacture method thereof, a housing inside the lamp and the use of the housing, and the light emitting diode (LED) lamp is described, comprising: a. at least one LED chip; b. a metal plate on which the at least one LED chip is arranged on the metal plate; c. an LED module which is in electric contact with the at least one LED chip; and d. a housing which is in contact with the metal plate, the LED module is arranged in the housing, and the housing comprises: 1) a resin layer having an inner surface and an outer surface; and ii) a metal layer which is arranged on at least a part of the outer surface of the resin layer in an overlying manner and is in contact with the metal plate; wherein the resin layer contains electric insulation thermoplastic resin compositions, and the metal layer contains aluminium alloys and has thermal conductivity of at least 20 W / m, K and at most 40 W / m, K, and thermal emissivity of 0.5 to 0.8. The invention also describes the LED housing inside he LED lamp and using the housings to keep the ambient temperature around the at least one LED chip lower than 70 DEG C.
Description
[0001] Cross References to Related Applications [0002] This patent application claims priority from the currently pending Japanese Patent Application No. 2011-174342 filed on Jul. 22, 2011 and is hereby incorporated by reference herein. technical field [0003] Described herein is a light emitting diode (LED) luminaire comprising a two-layer housing having an inner resin layer fully or partially overlaid by an outer metal layer having a thermal conductivity and dielectric properties of at least 20 W / m,K. The thermal emissivity is between 0.5 and 0.8, and is in contact with the metal plate on which the LED chip is set. Background technique [0004] As a light source, light emitting diode (LED) lamps provide high light intensity and a longer life than incandescent bulbs. LED luminaires generally include an LED module and a housing for the module. An LED module is essentially a semiconductor and includes an LED chip (light source) and a carrier for the LED chip. LED chips...
Claims
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IPC IPC(8): F21S2/00F21V29/89F21V29/70
Inventor 铃木和雄宇根成实
Owner DU PONT KK
