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An additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil

A technology of the front shape of the rough surface of the wool foil and electrolytic copper foil, which is applied in the field of additives to improve the peak shape of the rough surface of the wool foil, and can solve the problems of uneven peak shape of the wool foil rough surface, prone to foaming, and low peel strength , to achieve the uniform distribution of crystal particles, improve the surface profile, and improve the effect of anti-peeling strength

Active Publication Date: 2015-04-22
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the additive used in the copper-dissolving raw foil section is generally animal bone glue with a molecular weight of several million. This additive has a strong leveling effect, and the surface profile of the produced copper foil is very low, and the peak shape of the rough surface of the wool foil is uneven. When manufacturing high-grade boards such as high-Tg boards and halogen-free boards, the peeling strength is low, which leads to easy occurrence of blistering, wire throwing and delamination after the circuit board is made, which seriously affects the quality of copper clad laminates and circuit boards

Method used

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  • An additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil
  • An additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil

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Effect test

Embodiment 1

[0019] Additives: sodium polydithiodipropanesulfonate 30ppm, polyethylene glycol-600012ppm, hydroxymethylcellulose 30ppm, maltodextrin 100ppm and sodium chloride 2ppm (in other embodiments, other chlorides can be used instead of chlorinated Sodium, make the concentration of the chloride ion in the solution be 2ppm, do not affect the effect of the present invention).

[0020] After the raw material copper wire is annealed to remove organic impurities, it is sent to the copper melting tank, and the solution containing sulfuric acid is sprayed on the copper wire to dissolve the copper wire to form a copper sulfate electrolyte, and then adjust the copper content in the copper sulfate electrolyte to 50% -70g / L, the content of sulfuric acid is 160-180g / L, and the temperature is 70-80°C; filter the copper sulfate electrolyte to remove organic impurities and other solid impurities, then send it to the high level tank and add additives, the flow rate of additives is 300-400mL / min, then...

Embodiment 2

[0023] Additives: sodium polydithiodipropanesulfonate 30ppm, polyethylene glycol-600012ppm, hydroxymethylcellulose 30ppm, maltodextrin 100ppm and sodium chloride 2ppm.

[0024] After the raw material copper wire is annealed to remove organic impurities, it is sent to the copper melting tank, and the solution containing sulfuric acid is sprayed on the copper wire to dissolve the copper wire to form a copper sulfate electrolyte, and then the copper content in the copper sulfate electrolyte is adjusted to 70 -90g / L, sulfuric acid content is 100-120g / L, temperature is 50-60°C; filter the copper sulfate electrolyte to remove organic impurities and other solid impurities, then send it to the high level tank and add additives, the flow rate of additives is 300-400mL / min, then send the copper sulfate electrolyte with additives to the electrolytic cell for electrodeposition to obtain wool foil, the flow rate of the electrolyte is 60-80m 3 / h, the current density is 5000-7000A / ㎡.

[00...

Embodiment 3

[0027] Additives: sodium polydithiodipropanesulfonate 50ppm, polyethylene glycol-600030ppm, hydroxymethylcellulose 50ppm, maltodextrin 100ppm and sodium chloride 5ppm. (In other embodiments, the additive may only contain any 2 or 3 or 4 of sodium polydithiodipropane sulfonate, polyethylene glycol-6000, hydroxymethyl cellulose, maltodextrin and sodium chloride material, does not affect the effect of the present invention.)

[0028] After the raw material copper wire is annealed to remove organic impurities, it is sent to the copper melting tank, and the solution containing sulfuric acid is sprayed on the copper wire to dissolve the copper wire to form a copper sulfate electrolyte, and then the copper content in the copper sulfate electrolyte is adjusted to 80% -90g / L, the sulfuric acid content is 100-120g / L, the temperature is 50-60°C; filter the copper sulfate electrolyte to remove organic impurities and other solid impurities, then send it to the high level tank and add addit...

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Abstract

The invention discloses an additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil. The additive is an aqueous solution containing any of two or more substances selecting from bis-(sodium sulfopropyl)-disulfide, polyethylene glycol, hydroxymethyl cellulose, malt dextrin and chloride. the use of the additive and the electrolytic copper foil production process of the present invention facilitates to improve the peak shape of the rough surface of rough foil, enables crystalline particles on the rough surface of rough foil are uniformly distributed, and can increase profile tolerance by a modest degree and improve peel strength; and the obtained rough foil is suitable for the preparation of high Tg panels and halogen-free panels and other high-end panels.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil production technology, in particular to an additive for improving the peak shape of the matte surface of wool foil and an electrolytic copper foil production process using the additive. Background technique [0002] Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. The production process of electrolytic copper foil mainly includes the following three processes: copper melting and raw foil, surface treatment and product slitting. Among them, the quality and stability of the raw foil produced in the copper-dissolving raw foil section mainly depend on the formula and addition method of additives. In additi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D7/06
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司