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Wafer brushing device and wafer brushing method

A technology of wafers and brushes, applied in cleaning methods using tools, cleaning methods using liquids, chemical instruments and methods, etc., can solve the problems of low scrubbing efficiency and long scrubbing time, and achieve reduced scrubbing time and improved scrubbing Efficiency, the effect of reducing the amount of cleaning solution

Active Publication Date: 2013-05-01
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing wafer scrubbing device has the defects of low scrubbing efficiency and long scrubbing time

Method used

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  • Wafer brushing device and wafer brushing method
  • Wafer brushing device and wafer brushing method
  • Wafer brushing device and wafer brushing method

Examples

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Embodiment Construction

[0042] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0043]In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element refer...

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Abstract

The invention discloses a wafer brushing device and a wafer brushing method. The wafer brushing device comprises a rack, a first hair brush, a second hair brush, a first cleaning solution supply unit and a second cleaning solution supply unit, wherein the first hair brush and the second hair brush are oppositely arranged on the rack at intervals and are used for respectively brushing two side surfaces of a wafer; the first cleaning solution supply unit and the second cleaning solution supply unit are oppositely arranged on the rack at intervals and are used for respectively supplying a cleaning solution to the two side surfaces of the wafer; and the quantity of the cleaning solution supplied by each of the first and second cleaning solution supply units is increased from inside to outside along the radial direction of the wafer. According to the wafer brushing device disclosed by the embodiment of the invention can be used for improving the wafer brushing efficiency, reducing the wafer brushing time and reducing the dosage of the cleaning solution for brushing the wafer.

Description

technical field [0001] The invention relates to a scrubbing device and a scrubbing method for wafers. Background technique [0002] After the chemical mechanical polishing of the wafer, a large amount of particles, organic matter and metal ions will remain on the surface of the wafer, so the wafer needs to be scrubbed. The existing wafer scrubbing device has the defects of low scrubbing efficiency and long scrubbing time. Contents of the invention [0003] This application is made based on the inventor's discovery of the following problems: Figure 6 As shown, the existing wafer scrubbing device uses two brushes to clamp the wafer, and the wafer is scrubbed by rotating the two brushes, and the wafer itself also rotates around its center. At the same time, the contact area between each brush and the wafer is a rectangular area (such as Figure 7 shown), the brushing of the wafer is completed in this rectangular area. When the wafer rotates once, the circle near the cente...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/04B08B1/00B08B3/02B08B3/08H01L21/67H01L21/02
Inventor 路新春梅赫赓裴召辉何永勇
Owner HWATSING TECH
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