Air cylinder for polishing head
A polishing head and cylinder technology, applied in the field of cylinders, can solve the problem that the polishing head cannot move up and down, achieve the effect of reasonable structure and reduce processing difficulty
Active Publication Date: 2013-06-12
TSINGHUA UNIV
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AI Technical Summary
Problems solved by technology
Another type of existing polishing head itself cannot move up and down. When picking up the wafer, the workstation needs to move up and down to pick up the wafer.
Method used
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Embodiment Construction
[0032] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0033] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element refe...
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The invention discloses an air cylinder for a polishing head. The air cylinder comprises a cylinder body, a piston and a piston rod, wherein the cylinder body is internally provided with a cavity, and a first and second air inlet channels are formed in the cylinder body; the piston is arranged in the cavity to divide the cavity into an upper sub-cavity and a lower sub-cavity, the first air inlet channel is communicated with the upper sub-cavity, and the second air inlet channel is communicated with the lower sub-cavity; and the piston rod is arranged in the cavity, the lower end of the piston rod stretches out of the cylinder body, the piston rod is connected with the piston so as to move up and down under the drive of the piston, a groove is formed in one of the top wall of the cavity and the upper surface of the piston rod, a protrusion which is located in the groove in a matching manner is arranged on the other one of the top wall of the cavity and the upper surface of the piston rod, and the groove and the protrusion are adaptive in shape so that the cylinder body drives the piston rod to rotate. The air cylinder for the polishing head, disclosed by the embodiment of the invention, not only can drive a wafer to move up and down, but also can transmit larger torque.
Description
technical field [0001] The invention relates to a cylinder, in particular to a cylinder for a polishing head. Background technique [0002] In the chemical mechanical polishing process, the polishing head plays a very important role. A type of existing polishing head adopts a wax patch method to pick up and fix the wafer. Another type of existing polishing head itself cannot move up and down. When picking up a wafer, the workstation needs to move up and down to pick up the wafer. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, an object of the invention is to propose a cylinder for a polishing head. [0004] In order to achieve the above object, according to an embodiment of the present invention, a cylinder for a polishing head is proposed, the cylinder includes a cylinder, the cylinder has a chamber, and the cylinder is provided with The first and second air inlet pa...
Claims
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IPC IPC(8): B24B41/047
Inventor 路新春许振杰周顺何永勇
Owner TSINGHUA UNIV