Microwave dielectric materials capable of burning with copper electrodes together, preparation method and application thereof

A technology of microwave dielectric materials and copper electrodes, applied in chemical instruments and methods, and other chemical processes, can solve the problems of difficult control of Zn/Ti ratio, lower density, lower density of ceramic diaphragms, etc., and achieve the temperature coefficient of resonance frequency Adjustable, moderate dielectric constant, high quality factor effect
CN103146345BActive Publication Date: 2014-08-27CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD +1
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD
Publication Date
2014-08-27

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Abstract

The invention discloses microwave dielectric materials capable of burning with copper electrodes together, a preparation method and application thereof. The microwave dielectric materials comprise: (1-zwt% ) ((ZnxM (1-x) (Til-y / 2Mgy) O3)) + zwt% low-melting-point glass, wherein the M is magnesium or manganese; 0<x <=0.6, 0<y <=0.1, 0<z <=10. According to the microwave dielectric material, dielectric constant is moderate, a quality factor is high, temperature coefficient of resonance frequency is adjustable, burning with the copper electrodes can be achieved. Ceramic materials are insoluble in solvents such as water and ethanol and do not occur gelation reaction with binders such as poly vinyl alcohol (PVA) and polyvinyl butyral (PVB), and ceramic diaphragm with high density can be obtained, and firing density of ceramic can not be reduced, the direction of microwave communication frequency developing to higher frequency can be satisfied. The microwave dielectric materials capable of burning with the copper electrodes together is low in cost and suitable for multi-layer microwave medium components and industrialization production of base plates.
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Description

technical field

[0001] The invention relates to the technical field of microwave dielectric materials used for microwave communication such as microwave components and microwave substrates, and in particular to a microwave dielectric material used for co-firing with copper electrodes, a preparation method and an application thereof. Background technique

[0002] With the urgent demand of modern communication technology for miniaturization, integration, modularization and low-cost components, low temperature co-fired ceramics (Low Temperature Co-fired Ceramics) with excellent electrical, mechanical, thermal properties and high reliability , LTCC) technology has become the preferred technology for the manufacture of communication components. The biggest feature of LTCC technology is that base metals (such as 0.97Ag-0.03Pd) are used as multilayer wiring conductor materials to improve signal transmission rate and reliability, and multiple microwave electronic components can be e...

Claims

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