Microwave dielectric materials capable of burning with copper electrodes together, preparation method and application thereof

Abstract

The invention discloses microwave dielectric materials capable of burning with copper electrodes together, a preparation method and application thereof. The microwave dielectric materials comprise: (1-z) wt% ((ZnxM (1-x) (Til-y / 2Mgy) O3)) + zwt% low-melting-point glass, wherein the M is magnesium or manganese; 0<x <=0.6, 0<y <=0.1, 0<z <=10. According to the microwave dielectric material, dielectric constant is moderate, a quality factor is high, temperature coefficient of resonance frequency is adjustable, burning with the copper electrodes can be achieved. Ceramic materials are insoluble in solvents such as water and ethanol and do not occur gelation reaction with binders such as poly vinyl alcohol (PVA) and polyvinyl butyral (PVB), and ceramic diaphragm with high density can be obtained, and firing density of ceramic can not be reduced, the direction of microwave communication frequency developing to higher frequency can be satisfied. The microwave dielectric materials capable of burning with the copper electrodes together is low in cost and suitable for multi-layer microwave medium components and industrialization production of base plates.

Description

technical field [0001] The invention relates to the technical field of microwave dielectric materials used for microwave communication such as microwave components and microwave substrates, and in particular to a microwave dielectric material used for co-firing with copper electrodes, a preparation method and an application thereof. Background technique [0002] With the urgent demand of modern communication technology for miniaturization, integration, modularization and low-cost components, low temperature co-fired ceramics (Low Temperature Co-fired Ceramics) with excellent electrical, mechanical, thermal properties and high reliability , LTCC) technology has become the preferred technology for the manufacture of communication components. The biggest feature of LTCC technology is that base metals (such as 0.97Ag-0.03Pd) are used as multilayer wiring conductor materials to improve signal transmission rate and reliability, and multiple microwave electronic components can be e...

AI Technical Summary

Problems solved by technology

U.S. Patent No. 5,723,395 points out that zinc metatitanate (ZnTiO 3 ) to add B 2 o 3 The sintering temperature can be lowered to 900°C, but this method B during the sintering process 2 o 3 It reacts with the zinc element in zinc metatitanate, which makes it difficult to control the Zn / Ti ratio. At the same time, due to the B 2 o 3 It is easily soluble in water, ethanol and other solvents, and has a gelation reaction with the most commonly used binders such as PVA and PVB, so that the ceramic powder cannot obtain high-density ceramic diaphragms after casting

[0006] From the analysis of the above existing technologies, it is not difficult to find that the use of Ag electrodes and Ag-Pd electrodes is not suitable for the development of microwave communication to higher frequencies. 2 o 3 Reducing the sintering temperature will reduce the density of the ceramic diaphragm, reduce the density, and greatly reduce the microwave dielectric properties of the device

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