Aluminum substrate film splicing manufacture method

A manufacturing method and technology for aluminum substrates, which are applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of unstable exposure accuracy, easy poor exposure, and low production efficiency at the interface, and achieve dimensional accuracy control. Expose quality problems, improve production efficiency and the effect of quality problems

Active Publication Date: 2013-06-12
KINWONG ELECTRONICS TECH LONGCHUAN
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AI Technical Summary

Problems solved by technology

It aims to solve the problems of low production efficiency, large manpower and material resources, unstable exposure precision at the interface and easy exposure failure in the image transfer of ultra-long boards in the existing technology.

Method used

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  • Aluminum substrate film splicing manufacture method
  • Aluminum substrate film splicing manufacture method
  • Aluminum substrate film splicing manufacture method

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Embodiment Construction

[0024] The present invention provides a film splicing method for an aluminum substrate. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] see figure 1 , which is a flow chart of the film splicing method for aluminum substrates of the present invention. As shown in the figure, the aluminum substrate film splicing manufacturing method is used for pattern transfer on a 1250mm aluminum substrate, wherein the method includes the following steps:

[0026] S1. Divide the design drawing into two parts of the film: the first part and the second part. The graphics of the first part and the second part need to be 5mm-10mm more than the dividing line to produce the film, and design the alignment graphics requi...

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Abstract

The invention discloses an aluminum substrate film splicing manufacture method which is used for pattern transfer of a 1250mm of aluminum substrate. Firstly, a designed drawing is divided into two parts of films: a first part and a second part; secondly, a film with a pattern and with a single edge of 0.3 mm is produced in a parting line portion as a third part; and finally, according to alignment patterns of the first part, the second part and the third part, the three films are aligned, adhered and pruned. Waste of manpower and material resources and influence on pattern transfer accuracy due to multiple times of exposure are avoided, production cost is reduced and production efficiency and quality are improved. Process capability is further improved. Extensible property of the manufactured film is better than a silver salt sheet with even larger size in the future due to the fact that the larger the size becomes, the larger the extensible property is. The film is divided into two parts so that the size of each film is easier to control. The extensible values of the two films can be compensated mutually so that size accuracy control is relatively easier.

Description

technical field [0001] The invention relates to the technical field of graphic transfer production, in particular to a method for splicing super-long (1250mm) aluminum substrate films. Background technique [0002] According to the latest development direction of the LED strategy formulated by the country and the absolute advantages of good heat dissipation and dimensional stability of the aluminum substrate, the LED industry is bound to replace the incandescent lamp market, of which indoor lighting is the largest market share, and the ultra-long T5 / T8 Lamp tubes are one of the products that are and will be produced in a very large volume at present and in the future. The structure of the aluminum substrate can be divided into three layers: the circuit layer, the dielectric layer and the aluminum base. The production equipment related to the production of the ultra-long aluminum substrate has matured in recent years and can realize the mass production of the ultra-long alumi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 邹文辉黄呈鹤曾庆辉王远
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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