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Data storage device and manufacturing method thereof

A technology for data storage and devices, which is applied in the field of data storage devices and its manufacturing, and can solve problems such as reducing the reliability of data storage devices

Active Publication Date: 2017-03-01
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, high integration may reduce the reliability of data storage devices

Method used

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  • Data storage device and manufacturing method thereof
  • Data storage device and manufacturing method thereof
  • Data storage device and manufacturing method thereof

Examples

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no. 1 approach

[0070] Figure 1A is a plan view illustrating a data storage device according to some exemplary embodiments, Figure 1B is along Figure 1A Exemplary cross-sectional view taken on line I-I' of Figure 1C is along Figure 1A An exemplary cross-sectional view taken along the line II-II'. figure 2 is a perspective view illustrating an exemplary data storage device according to some embodiments. In order to clearly show the components of a data storage device according to an embodiment, in figure 2 Some components (for example, interlayer dielectric layers and bit lines) are omitted in .

[0071] refer to Figure 1A , Figure 1B , Figure 1C and figure 2 , a plurality of cell selection parts may be disposed on the semiconductor substrate 100 (hereinafter, referred to as 'substrate') or as a part of the semiconductor substrate 100 . For example, the substrate 100 may be a silicon substrate, a germanium substrate, or a silicon-germanium substrate. A plurality of cell selec...

no. 2 approach

[0156] In another embodiment, the same elements described in the first embodiment will be denoted by the same reference numerals or the same reference symbols. For ease and convenience of explanation, descriptions of the same elements as those in the first embodiment will be omitted or briefly stated. Hereinafter, differences between the second embodiment and the first embodiment will be mainly described.

[0157] Figure 15A is a plan view showing a data storage device according to an exemplary embodiment, Figure 15B is along Figure 15A Exemplary cross-sectional view taken on the line V-V', Figure 16 is an exemplary perspective view showing a data storage device according to one embodiment. Figure 17 is a cross-sectional view illustrating a modified embodiment of a data storage device according to other exemplary embodiments. In order to clearly show the basis Figure 15A , Figure 15B and Figure 16 The components of the data storage device of the embodiment show...

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Abstract

The present application provides a data storage device and a manufacturing method thereof. The device may include: a plurality of cell selection parts formed in the substrate; a plate conductive pattern covering the cell selection part and electrically connected to the first terminal of the cell selection part; a plurality of through-pillars penetrating the board conductive pattern and conducting with the board pattern insulation; and a plurality of data storage parts respectively directly connected to a plurality of through pillars. The data storage parts may be electrically connected to the second terminals of the cell selection part, respectively.

Description

[0001] This application claims priority from Korean Patent Application No. 10-2011-0134422 filed on Dec. 14, 2011, the entire contents of which are hereby incorporated by reference. technical field [0002] The present disclosure relates to semiconductor devices and methods of manufacturing the same, and more particularly, to data storage devices and methods of manufacturing the same. Background technique [0003] Semiconductor devices are extremely attractive in the electronics industry due to their small size, multifunctionality, and / or low manufacturing cost. Data storage devices in semiconductor devices can store logical data. Data storage devices are more highly integrated with the development of the electronics industry. Thus, the line width of each component constituting the data storage device is reduced. [0004] In addition, high reliability and high integration of data storage devices are required. However, high integration may reduce the reliability of data st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/10H01L21/82
CPCH01L27/0203H01L2924/0002H10B63/30H10B61/22H10B63/80H10N70/231H10N70/20H10N70/826H10N70/8825H10N70/8828H10N70/8833H10N70/8836H10N70/011H01L2924/00H01L21/823475H10B10/00H10B12/00H01L27/10H01L27/105H01L23/5226H01L23/528H01L29/4236
Inventor 宋正宇李宰圭
Owner SAMSUNG ELECTRONICS CO LTD