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Lead frame packaging structure

A packaging structure and lead frame technology, which is applied to semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of crosstalk interference, lack of availability, and reduction of the number of lead frames 100 installed.

Inactive Publication Date: 2013-07-03
NOVATEK MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] It can be seen from the above that the lead frame package structure 10 is not a multi-layer board structure (multi-layer), so it does not have a reference ground plane (reference ground plane) design like a printed circuit board, so it has difficulties in impedance control and crosstalk interference (crosstalk). ) problem, and the lack of high loop inductance (loop inductance) of the power distribution network (power distribution network, PDN), etc.
In order to solve the above-mentioned deficiency, in the prior art, the lead frame packaging structure 10 is provided with a ground wire between each lead frame 100, but this method will reduce the number of lead frames 100, thus causing signal output (pin out) amount reduced

Method used

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Embodiment Construction

[0032] Please refer to Figure 4 , Figure 4 It is a schematic diagram of a lead frame packaging structure 40 according to an embodiment of the present invention. The lead frame packaging structure 40 includes a lead frame 400 , a chip 41 , a carrier 42 and an encapsulant 43 . The lead frame 400 includes an outer lead 402 , an inner lead 404 and a lead portion 406 . Wherein, the outer pin 402 is electrically connected to the printed circuit board (not marked in Figure 4 Middle), the inner pin 404 is electrically connected to the chip 41 through the gold wire 403 , and the wire portion 406 is electrically connected to the inner pin 402 and the outer pin 404 . The carrier 42 is used to carry the chip 41 . The encapsulant 43 is used to cover the lead frame 400 and the chip 41 . In this embodiment, the outer pin 402 can be a Gull-Wing pin.

[0033] It should be noted that the height of the wire portion 406 in the embodiment of the present invention needs to be lower than th...

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Abstract

The invention discloses a lead frame packaging structure which comprises at least one bearing seat and at least one lead frame, wherein the bearing seats are used for bearing a chip, each lead frame comprises a first end which is electrically connected with a printed circuit board, a second end which is electrically connected with the chip and a lead part which is connected with the first end and the second end, and the height of the lead part is lower than the heights of the first end and the second end.

Description

technical field [0001] The invention relates to a lead frame package structure, in particular to a lead frame package structure with low electromagnetic and low crosstalk interference. Background technique [0002] Integrated circuit (IC) packaging can be divided into lead frame package, rigid plastic substrate package, flexible substrate package (tape package) and ceramic substrate package according to the carrier material of the chip. (ceramic package). Among them, the lead frame package has the characteristics of low cost and low-speed signal transmission requirements (that is, it is not suitable for high-speed signal transmission interfaces, such as DDR3-1333Mbps, HDMI or USB3). [0003] Please refer to figure 1 , figure 2 and image 3 , figure 1 It is a schematic view of the appearance of the existing lead frame packaging structure 10, figure 2 is a top view of the existing lead frame packaging structure 10, and image 3 It is a structural diagram of the existi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L2224/45144H01L2224/48247H01L2224/49171H01L2924/00
Inventor 白育彰
Owner NOVATEK MICROELECTRONICS CORP
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