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Flame-retardant microencapsulated alloy preparation technology

A preparation process and microcapsule technology, which is applied in the field of preparation of microencapsulated flame-retardant ABS/PC alloys, can solve the problems of difficult migration and high flame-retardant efficiency

Inactive Publication Date: 2013-07-17
QINGDAO FEITE ELECTRICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to prepare a microencapsulated flame-retardant ABS / PC alloy, which has good thermal stability, good melt fluidity during processing, high flame-retardant efficiency, and is not easy to absorb moisture and migrate. The product has high dimensional stability and can be used in injection molding to manufacture electrical casings, automotive dashboards, air blowers, battery packs, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for preparing microencapsulated flame-retardant ABS / PC alloy, comprising the following steps:

[0026] a Put the following components by mass into the stirring tank and mix and stir for 5-10 minutes: ammonium polyphosphate 61, char forming agent 31, synergist 1;

[0027] b. Spray the atomized polyorganosiloxane diluent into the stirred tank for 5-10 minutes, and let it stand for 10 minutes after the stirring is completed to form a microcapsule flame retardant;

[0028] c Add ABS and PC pellets and stir well to make the microcapsule flame retardant adhere to the ABS and PC pellets, then discharge and dry.

[0029] The above-mentioned ammonium polyphosphate is type II APP with a degree of polymerization n=2000; the above-mentioned char-forming agent is pentaerythritol; the above-mentioned synergist is nano-scale zinc oxide with a particle diameter below 100nm; the above-mentioned polyorganosiloxane is polydimethyl Siloxane, whose added amount accounts for 6%-8% ...

Embodiment 2

[0034] Repeat Example 1, the difference is that the mass parts of each component of the microcapsule flame retardant are ammonium polyphosphate 65, char-forming agent 35, synergist 3; also add phenylboronic acid compound in step c; the described The char-forming agent is dipentaerythritol; the synergist is nano-scale silicon dioxide with a particle size below 100nm; the polyorganosiloxane is polyaminosiloxane, which is dissolved in absolute ethanol.

[0035] The microencapsulated flame-retardant ABS / PC alloy contains the following components and mass percentages:

[0036] Acrylonitrile-butadiene-styrene (ABS) 70%

[0037] Polycarbonate (PC) 13%

[0038] Microencapsulated flame retardant 14%

[0039] Phenylboronic acid compound 3%.

Embodiment 3

[0041] Repeat Example 1, the difference is that the mass parts of each component of the microcapsule fire retardant are ammonium polyphosphate 63, char-forming agent 33, synergist 2; also add nanometer montmorillonite in step c; The char-forming agent is starch; the synergist is nano-scale titanium dioxide with a particle diameter below 100nm; the polyorganosiloxane is polysilicone resin, which is dissolved in absolute ethanol.

[0042] The microencapsulated flame-retardant ABS / PC alloy contains the following components and mass percentages:

[0043] Acrylonitrile-butadiene-styrene (ABS) 25%

[0044] Polycarbonate (PC) 60%

[0045] Microencapsulated Flame Retardant 12%

[0046] Nano montmorillonite 3%.

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Abstract

A flame-retardant microencapsulated alloy preparation technology comprises the following steps: 1, adding 61-65 parts by mass of ammonium polyphosphate, 31-35 parts by mass of a carbonizing agent and 1-3 parts by mass of a synergist to a stirring kettle, and mixing and stirring for 5-10min; 2, sprinkling an atomized polysiloxane diluent to the inside of the stirring kettle for 5-10min, and allowing the obtained mixture to stand for 10min after stirring ending to form a microcapsule flame retardant; and 3, adding ABS and PC granules, fully stirring for adhering the microcapsule flame retardant on the ABS and PC granules, discharging the obtained material, and drying.

Description

technical field [0001] The invention relates to a preparation process of a flame-retardant microencapsulated alloy, and furthermore, to a preparation method of a microencapsulated flame-retardant ABS / PC alloy. Background technique [0002] ABS resin is a terpolymer of acrylonitrile (A), butadiene (B) and styrene (S). Combining the superior properties of the three components, it has high impact strength, good processing performance and chemical It is stable, easy to mold, and the product is glossy and tough. It is a general-purpose thermoplastic engineering plastic with superior performance. Polycarbonate (PC) resin is a thermoplastic engineering plastic with excellent performance. It has outstanding impact resistance, creep resistance and dimensional stability, heat resistance, low water absorption, non-toxicity, and excellent dielectric properties. ABS resin and PC resin have good compatibility, combining the advantages of both to prepare ABS / PC alloy is widely used in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L55/02C08K9/10C08K3/32C08K3/34C08K5/55C08K13/06B01J13/02
Inventor 张宗有
Owner QINGDAO FEITE ELECTRICAL TECH