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chemical mechanical grinding equipment

A technology of chemical machinery and equipment, applied in the field of chemical mechanical grinding equipment, to achieve the effect of prolonging the residence time and improving the utilization rate

Active Publication Date: 2015-12-09
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the concentric circular groove polishing pad cannot completely overcome the problems of uneven distribution of polishing liquid and low utilization rate.

Method used

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  • chemical mechanical grinding equipment
  • chemical mechanical grinding equipment
  • chemical mechanical grinding equipment

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Embodiment Construction

[0018] The invention provides a kind of chemical mechanical polishing equipment, comprising: a polishing table, having a polishing surface and a polishing bottom surface opposite to the polishing surface, the direction of the polishing surface is consistent with the horizontal direction, a polishing pad, attached above the polishing surface, the The grinding table and the grinding pad can rotate around the rotating shaft in the horizontal direction, and the distance between the grinding surface and the grinding bottom surface increases from the outward of the grinding surface to the edge of the grinding surface.

[0019] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments. In order to better illustrate the technical solution of the present invention, please refer to figure 2 A schematic structural diagram of a chemical mechanical polishing device according to an embodiment of the present invention is show...

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Abstract

The invention provides chemical mechanical polishing equipment. The chemical mechanical polishing equipment comprises a polishing table and a polishing pad, wherein the polishing table is provided with a polishing surface and a polishing bottom face opposite to the polishing surface, the direction of the polishing surface is consistent with the horizontal direction, the polishing pad is stuck on the upper side of the polishing surface, the polishing table and the polishing pad can rotate around a rotary shaft in the horizontal direction, and the distance from the polishing surface to the polishing bottom face increases outwards from the polishing surface to the edge of the polishing surface. The chemical mechanical polishing equipment provided by the invention has the advantage that the utilization ratio of polishing liquid is increased.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to chemical mechanical polishing equipment. Background technique [0002] Chemical Mechanical Polishing (CMP) is a process in which a chemical reaction process and a mechanical polishing process work together. Please refer to figure 1 The schematic diagram of the structure of the existing chemical mechanical polishing equipment is shown. During the chemical mechanical polishing process, the grinding liquid flows to the surface of the grinding pad 3 at a certain rate, and the grinding head 5 applies a certain pressure on the back side of the semiconductor substrate 4, so that the front of the semiconductor substrate 4 is close to the grinding pad 3, The grinding head 3 drives the semiconductor substrate 4 and the grinding pad 3 to rotate in the same direction, so that the front surface of the semiconductor substrate 4 and the grinding pad 3 generate mechanical friction. Dur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/10B24B37/34
Inventor 邓镭
Owner SHANGHAI HUALI MICROELECTRONICS CORP