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Method of manufacturing substrate for LED module and substrate for LED module manufactured by the same

A technology for LED modules and substrates, applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve problems such as damage to source substrates

Inactive Publication Date: 2013-10-23
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the manufacturing process of the related art, even during the surface treatment process, the surface treatment is applied to the entire substrate in a state where a circuit pattern is generated on the source substrate, and thus, the source substrate may be damaged

Method used

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  • Method of manufacturing substrate for LED module and substrate for LED module manufactured by the same
  • Method of manufacturing substrate for LED module and substrate for LED module manufactured by the same
  • Method of manufacturing substrate for LED module and substrate for LED module manufactured by the same

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Embodiment Construction

[0031] Various advantages and features of the present invention and methods of accomplishing them will become apparent from the ensuing description of the embodiments with reference to the accompanying drawings. However, the invention may be modified in many different forms and should not be limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals denote like elements (elements) throughout this specification.

[0032] The terms used in this specification are for explaining the embodiments rather than limiting the present invention. A singular form in this specification includes a plural form unless clearly described to the contrary. The word "comprising" and variations such as "comprising" or "comprising" will be understood to mean the inclusion of certain elements, steps, operations and / or elements, b...

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Abstract

Disclosed herein are a method of manufacturing a substrate for an LED module and a substrate for an LED module manufactured by the same, including: providing a base substrate having metal layers formed on both surfaces thereof; forming circuit patterns on the metal layers; applying a solder resist layer onto the circuit patterns; forming a through hole penetrating through the base substrate; separating the base substrate up and down; and bonding each of the separated base substrates to a parent substrate, thereby preventing light reflectivity of a parent substrate from being degraded due to a resist applying process and a surface treatment process.

Description

[0001] References to related applications [0002] This application claims Korean Patent Application Serial No. 10 filed on March 28, 2012 under 35 U.S.C. Section 119, entitled "Method for Manufacturing Substrate for LED Module and Substrate for LED Module Made Therefrom" - the benefit of 2012-0031796, the entire contents of which are hereby incorporated by reference into this application. technical field [0003] The present invention relates to a method of manufacturing a substrate for an LED module and a substrate for an LED module manufactured therefrom, and more particularly, to a method for manufacturing a substrate for an LED module capable of maintaining light reflectivity of a source substrate (parent substrate). Substrate method and substrate for LED modules manufactured therefrom. Background technique [0004] Recently, light emitting diodes (hereinafter, referred to as LEDs) have attracted interest as lighting and light emitting devices capable of achieving ligh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H01L33/60H01L33/62
CPCH01L33/08H01L33/60H05K3/00H01L21/02H01L33/62H01L33/48H05K3/0061H05K3/0097H05K3/06H05K2201/09063H05K2201/10106H05K2201/2054H05K2203/0156H01L2924/0002H01L2924/00
Inventor 李亮制许哲豪杨德桭林京焕
Owner SAMSUNG ELECTRO MECHANICS CO LTD