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resin composition

A technology of resin composition and polybutadiene resin, which can be used in coatings, electrical components, circuits, etc., can solve the problems of low temperature curable cured product flexibility and insufficient printability, and achieve surface protection and printability. Excellent, bendability reduction effect

Active Publication Date: 2017-09-08
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in International Publication No. 2009 / 051209, a method of printing a varnish-like resin composition (protective layer coating agent) into a desired pattern by screen printing and curing it is proposed, but the properties of the resin composition ( That is, low-temperature curability, flexibility of cured products, printability, etc.) are insufficient, and there is still room for improvement

Method used

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  • resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0134] A resin varnish was prepared in the same manner as in Example 1 except that the manufactured product 1 of Example 1 was changed to manufactured product 2 .

Embodiment 3

[0136] In addition to changing production 1 of Example 1 to production 3, changing the compounding amount of tris(3-mercaptopropyl)isocyanurate to 3.7 parts, and changing the compounding amount of "R-805" to Except for 6.2 parts, a resin varnish was produced in exactly the same manner as in Example 1.

Embodiment 4

[0138] A resin varnish was produced in exactly the same manner as in Example 1 except that Product 1 of Example 1 was changed to Product 4 .

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Abstract

The present invention relates to a resin composition containing (A) a polybutadiene resin having an epoxy group and a urethane structure, and (B) a thiol-based curing agent, characterized in that the total solid The content of (A) the polybutadiene resin having an epoxy group and a urethane structure is 50 to 95% by mass based on 100% by mass of the components.

Description

technical field [0001] The present invention relates to resin compositions. Specifically, it relates to a resin composition suitable as a material for surface protection and insulation of devices, devices, members, etc. in various technical fields. Background technique [0002] In recent years, thin film transistors (TFTs) using organic semiconductor layers have attracted attention in the fields of various display devices such as organic EL displays and electronic paper, and are called organic TFTs. The organic TFT is most promising as a device to replace the conventional inorganic TFT using an inorganic semiconductor layer, and its application includes various electronic devices such as the above-mentioned display device. Since organic TFTs can form an organic semiconductor layer at a temperature lower than that of vapor deposition and the like compared with inorganic TFTs, it is expected that TFTs can be mounted on substrates such as plastic films with low heat resistance...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L75/04C08G18/62C08G18/58C09D175/04
CPCH05K3/28C08G18/58C08G18/69C08G59/18C08G59/66C08J5/18C08K3/00C08K5/37C08L47/00H01L2924/13069C08K2201/005H10K10/46H10K50/844
Inventor 野内峰雄田端久志古田清敬
Owner AJINOMOTO CO INC