An LED packaging structure with an asymmetric rectangular light spot

A technology of LED packaging and rectangular spot, applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of light energy waste, increase density, increase road construction costs, etc., achieve uniform brightness and improve overall light efficiency

Inactive Publication Date: 2016-04-13
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For LED street lights with circular facula, the range of application is very limited because of the large deviation between the facula and the shape of the road, and the uneven distribution of light intensity; for LED street lights with elliptical facula, the uniformity of light pattern and light intensity are better than those of circular facula. The advantages of LEDs have been improved, but the advantages of LEDs are still not fully utilized; for LED street lights with symmetrical rectangular spots, the light energy is basically put on the straight road, and the light distribution curve is shaped like a bat, so that within the irradiation range of the lamps, the light strong basic uniform
The left-right symmetrical rectangular light spot is a good light distribution for straight roads, but for a large number of roads with curves, lanes, roundabouts, etc., the left-right symmetrical rectangular light spot is due to the mismatch between the shape of the light spot and the shape of the road. Therefore, it is necessary to increase the density of street lamps, which often needs to be doubled, which greatly increases the construction cost of the road, and also causes a huge waste of light energy
[0005] In addition, the current packaging is basically soldering the LED chip on the aluminum substrate, so that the light from the LED chip to the substrate cannot be effectively exported, and it is basically converted into heat energy.
Such packaging is not only a waste of light energy, but also increases the burden on the device for heat dissipation

Method used

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  • An LED packaging structure with an asymmetric rectangular light spot
  • An LED packaging structure with an asymmetric rectangular light spot
  • An LED packaging structure with an asymmetric rectangular light spot

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Such as Figure 1 to Figure 4 As shown, an LED packaging structure with an asymmetric rectangular spot includes a heat dissipation aluminum groove 6 with a reflective surface, a transparent heat conduction ceramic 5 arranged at the bottom of the groove of the heat dissipation aluminum groove 6, and the transparent heat conduction ceramic 5 is provided with embedded Type copper foil, the embedded copper foil is connected to the LED chip 4 mounted on the transparent heat-conducting ceramics, the LED chip 4 is evenly sprayed with phosphor powder 3, and the opening of the heat dissipation aluminum groove 6 is potted and set There is a transparent silica gel 1, and the LED chip 4 is connected with the electrode connecting gold wire 2. Considering that the height of the street lights is 10 meters, the spacing is 50 meters, and there are 4 lanes, each lane is 3.75 meters wide. The upper end of the transparent heat-conducting ceramic 5 is provided with an inclined surface 8, an...

Embodiment 2

[0038] In this embodiment, except the following features, all the other features are the same as in Embodiment 1:

[0039] The maximum outgoing angle on the right side of the present embodiment is 61 degrees, the angle between the upper reflection surface 10 on the left side and the bottom plane of the groove is 82.8 degrees, and the angle between the reflection surface 7 on the right side and the bottom plane of the groove is 32 degrees. The length of the right side of the illuminated rectangular spot is shortened to 18 meters, and the left side is still about 4 meters.

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Abstract

The invention discloses an unsymmetrical rectangular spot LED packaging structure. The LED packaging structure comprises a radiating aluminum tank with high reflection surfaces, a high-heat-conductivity transparent ceramic chip, an LED chip, evenly sprayed fluorescent powder and a transparent silica gel lens enabling light distribution of rectangular spots to be uniform. According to the packaging structure, under the condition that upward light emission is not influenced, light rays emitted downwards can be effectively led out, and luminous efficiency of LED lamp beads is greatly improved. Additionally, by adjustment of angles and heights of the aluminum heat sink reflection surfaces and appearance of encapsulated silica gel, the unsymmetrical leftward or rightward rectangular spots are obtained. An LED of the packaging structure can obtain better luminous efficiency, and LED light energy can be better used to meet lighting requirements of complex roads.

Description

technical field [0001] The invention relates to an LED packaging structure, in particular to an LED packaging structure with an asymmetrical rectangular light spot. Background technique [0002] In recent years, LED lighting technology has been developed by leaps and bounds. With the development of power LED device technology, LED has been widely used in the field of outdoor lighting, especially in the field of street lighting for road lighting. With its advantages of high luminous efficiency, long life, wide color gamut, high operating frequency, and no mercury, LED will gradually replace traditional incandescent lamps, halogen lamps and even high-pressure sodium lamps, and will surely become the mainstream of street light sources for road lighting. [0003] The performance of LED street lights depends to a certain extent on the packaging quality of LED lamp beads. Some lamp beads have a circular light spot, some are oval, and the newer one is rectangular. Street lamp sha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/60H01L33/50
Inventor 邓云龙文尚胜
Owner SOUTH CHINA UNIV OF TECH
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