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Method for silicon micro-resonant type accelerometer temperature compensation

An accelerometer and temperature compensation technology, applied in the direction of measuring acceleration, speed/acceleration/shock measurement, measuring devices, etc., can solve problems such as poor effect and hysteresis effect

Active Publication Date: 2013-12-25
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the uncertainty of the temperature field distribution and the time delay of heat conduction, this compensation method does not work well and has a hysteresis effect

Method used

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  • Method for silicon micro-resonant type accelerometer temperature compensation
  • Method for silicon micro-resonant type accelerometer temperature compensation
  • Method for silicon micro-resonant type accelerometer temperature compensation

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Embodiment Construction

[0049] The present invention will be further described below in conjunction with the accompanying drawings.

[0050] A method for temperature compensation of a silicon microresonant accelerometer, comprising the steps of:

[0051] (1) In the case of no acceleration signal input, the resonant frequency and DC drive voltage of the silicon microresonant accelerometer are measured within the range of ambient temperature -40 ~ 60 ℃, and the resonance of resonant beam 1 and resonant beam 2 is obtained. A monotonic relationship curve of frequency changing with temperature and a monotonic relationship curve of DC driving voltage changing with temperature; the silicon microresonant accelerometer has two resonant beams, which are respectively recorded as resonant beam 1 and resonant beam 2; specifically include the following steps:

[0052] (11) Calibrate s temperature points within the range of ambient temperature -40-60°C; for example, take 10°C as the temperature interval, divide the...

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Abstract

The invention discloses a method for silicon micro-resonant type accelerometer temperature compensation. The method comprises the steps that firstly, under the condition that the accelerated speed does not exist, a singular change relation curve of a direct current drive voltage maintaining the constant resonant amplitude of a resonant beam and the resonant frequency of the resonant beam is calibrated; secondly, under the condition that the accelerated speed exists, the direct current drive voltage and the resonant frequency are measured; thirdly, combined with the previously obtained relation curve, the resonant frequency caused by the temperature is subtracted from the resonant frequency obtained through measurement and the temperature compensation operation is completed. According to the method for silicon micro-resonant type accelerometer temperature compensation, the defect that large deviation of a compensation result is caused by the non-determinacy of temperature field distribution in a traditional direct temperature compensation method and heat conduction delay is overcome, and real-time and high-accuracy temperature compensation is achieved. According to the method, the cost of temperature compensation is low, sensors do not need to be additionally arranged, and temperature compensation can be achieved through existing circuit devices.

Description

technical field [0001] The invention relates to a silicon micro-resonance accelerometer temperature compensation method, in particular to a method for temperature compensation of the silicon micro-resonance accelerometer by using the accelerometer's own driving voltage signal instead of directly measuring the temperature signal. Background technique [0002] The silicon microresonant accelerometer is based on MEMS technology, with two resonant beams forced to bend and vibrate as the force sensitive unit, and the vibration frequency difference between the two resonant beams (resonant beam 1 and resonant beam 2) characterizes the magnitude of the acceleration. Because the elastic modulus of the resonant beam is affected by temperature, and the thermal expansion coefficient of the silicon micro-device is different from that of the substrate, the measurement accuracy of the silicon micro-resonant accelerometer is significantly affected by the temperature. In order to compensate ...

Claims

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Application Information

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IPC IPC(8): G01P15/097
Inventor 赵立业杨辉黄丽斌李宏生
Owner SOUTHEAST UNIV
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