Heat dissipation structure possessing double wind directions

Abstract

A heat dissipation structure possessing double wind directions comprises a pedestal, a plurality of heat pipes and a plurality of cooling fins. The heat pipes are extended from one side of the pedestal. The cooling fins are arranged on the heat pipes with intervals according to a sequence so as to form a state in which the cooling fins and the pedestal are mutually superposed. At least one flow deflector is arranged on each cooling fin. During assembling, a horizontal diversion channel is formed among the cooling fins. The flow deflector forms a lower diversion channel. During usage, a wind power source is used and the heat dissipation structure possessing the double wind directions is used to carry out sidewall air supply so that one part of wind power diversion takes away heat of the cooling fins through the horizontal diversion channel and another part of the wind power diversion carries out downwards waftage through the lower diversion channel so as to directly dissipate the heat around an electronic component. Heat dissipation efficiency is greatly increased.

Description

technical field [0001] This case belongs to the field of heat dissipation equipment used in electronic devices, especially about a heat dissipation structure with dual air directions, which can generate horizontal airflow and downward airflow at the same time to dissipate heat from an electronic component and its surroundings. Background technique [0002] With the rapid development of science and technology, computer information technology has also been highly developed, which has greatly increased the computing speed of electronic components inside the computer, and the largest heat generation in the computer is the central processing unit (CPU). In order to take into account the stability of its operation And efficiency, and utilize a cooling device to dissipate heat. [0003] Generally, the most common heat dissipation device includes a heat sink and a heat dissipation fan, and the heat sink is selected from a structure with multiple heat dissipation fins stacked on each...

AI Technical Summary

Problems solved by technology

[0004] However, limited by the shape of the radiator and the arrangement of the cooling fan, when the fan blows airflow downward or sideways in the cooling direction, and there is not enough space between the radiator and the electronic component, the airflow It cannot be blown directly to the electronic component and its surroundings, so most heat sinks can only use contact conduction to dissipate heat from the electronic component, but for the electronic component that generates a lot of heat in an instant, this kind of heat dissipation The design of the device is no longer adequate

Images