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Electroplating treatment method for connectors and joints with controlled solder wettability joints

A technology of electroplating treatment and connectors, which is applied in the direction of connection, circuit, contact parts, etc., can solve the problems of narrow soldering area, poor contact, unstable soldering fixation, etc., and achieve the effect of low price

Active Publication Date: 2016-01-20
HIROSE ELECTRIC GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in this conventional structure, the soldered part is only the soldered fixing part 117 provided on the lower side of the base 111, so the soldered area is narrowed and the soldered fixing is unstable. Danger
Although the lower arm portion 114 can be used for soldering from a structural point of view, since the lower arm portion 114 is a part for contacting with a mating joint, if this portion 114 is fixed by soldering, it will cause Poor contact, in addition, it will also have an adverse effect on the spring performance

Method used

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  • Electroplating treatment method for connectors and joints with controlled solder wettability joints
  • Electroplating treatment method for connectors and joints with controlled solder wettability joints
  • Electroplating treatment method for connectors and joints with controlled solder wettability joints

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Embodiment Construction

[0028] Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings.

[0029] figure 1 It is a perspective view showing the structure before fitting of the receptacle connector (electrical connector) 60 and the plug connector (mating-side connector) 10 according to one embodiment of the present invention. figure 2 , image 3 These are a perspective view and a bottom view showing the mated structure of the receptacle connector and the plug connector, respectively. First, refer to Figure 1~3 The structures of the receptacle connector and the plug connector according to one embodiment of the present invention will be described.

[0030] The plug connector 10 has a plurality of joints 11, and the receptacle connector 60 has a plurality of joints 70, and is used in such a manner that the plug connector 10 and the receptacle connector 60 are electrically connected to each other by fitting them together. The plug connector 10 an...

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Abstract

The purpose of the present invention is to provide a contact configuration capable of soldering a contact with certainty while solving a solder wicking problem. A contact includes a base, an arm part extending from a side of the base, and a solder fixing part extending from the other side. A contact portion occupying a portion of the contact is covered with band-shaped regions, which have a straight line shape with a certain width, consisting of: a connection portion between the arm part and the base; and a middle portion between a free end extended from the solder fixing part and an end edge opposite to an extended side from the base, wherein soldering wettability of the contact portion is set to be lower than that of the other portions of the contact which are not covered with the band-shaped regions.

Description

technical field [0001] This invention relates to connectors having joints which control solder wettability and methods of plating such joints. Background technique [0002] exist Figure 8 A conventional example of a joint that controls solder wettability disclosed in Patent Document 1 is shown in . The joint mainly includes: a base 111; a lower arm 114, the lower arm 114 is extended from the lower side of the above-mentioned base 111, and protrudes upward near the free end of the extended side to match with the supporting joint (not shown in the figure). (shown) the contact part 113 in contact with; and the upper arm part 115 connected to the lower arm part 114 via the base part 111 and extending from the upper side of the base part 111 approximately parallel to the lower arm part 114 . [0003] In order to control the solder wettability, the joint part 116 is covered by a strip-shaped area passing through the vicinity of the joint part of the lower arm part 114 and the ba...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R43/16
CPCH01R13/03H01R43/0235
Inventor 宫崎敦宏
Owner HIROSE ELECTRIC GROUP