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Nozzle structure of local soft soldering appts.

A soldering and nozzle technology, applied in the field of nozzle structure, can solve the problems of configuration position limitation, difficult to correspond, poor soldering and so on

Inactive Publication Date: 2005-03-30
株式会社东北弘辉 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, since the overflow amount from the outlet 20 m to the lateral direction increases in this way, there is a problem of contacting the lead wire 1 of the adjacent electronic component d under the aforementioned trend of narrowing the component intervals, so it is difficult to deal with it in practice ( Figure 4 (B))
In addition, in order to increase the flow rate of overflow solder, it is conceivable to increase the outlet by 20m, but due to the high density of components, there are restrictions on the placement position, so it is still difficult to respond
[0009] In addition, in the above-mentioned way of overflowing from the opening edge 20e, the liquid flow on the surface will wash away the pre-coated local flux, which also has the problem of poor soldering.

Method used

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  • Nozzle structure of local soft soldering appts.
  • Nozzle structure of local soft soldering appts.
  • Nozzle structure of local soft soldering appts.

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Embodiment Construction

[0017] Hereinafter, specific embodiments of the nozzle structure of the local soldering apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

[0018] FIG. 1 is a perspective view showing a nozzle structure of an example of the present embodiment, and FIG. 2 is a longitudinal cross-sectional view showing a soldering state of the present embodiment.

[0019] The nozzle of the embodiment according to the present invention is improved from the nozzle of the conventional structure described above, and the parts other than the improvement are the same as those of the conventional example, so the same reference numerals are attached and the description thereof is omitted.

[0020] The nozzle 1 shown in the figure forms a cylindrical body 2 having an opening edge 2e whose upper part is opened in a predetermined shape, and is provided on the upper surface of a base 3 provided in a soldering tank b. The opening edge 2e for...

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Abstract

Weif orifice for flooding soldering tin from nozzle is setup at sidewall under edge of opening in feasible distance. Thus, soldering can be carried out reliably under condition out of touching adjacent electronic units by flooded soldering tin, even if parts are configured in high density.

Description

technical field [0001] The present invention relates to a nozzle structure of a local soldering device for soldering a desired specific portion (part) of an electronic component by bringing a nozzle that sprays molten solder into contact with a printed circuit board. Background technique [0002] The mounting of electronic components on a printed circuit board is usually mainly based on electrical connection by soldering. However, in recent years, with the miniaturization of electrical products, double-sided reflow soldering (molten solder), which is different from conventional lead-inserted components, has appeared. Substrate SMP (Surface Mount Parts: Chip Components) has promoted the reduction of the thickness and size of the substrate for high-density mounting. [0003] However, in the current situation, a lead insertion type component has to be mixed, and a solder substrate (hereinafter abbreviated as "substrate") is used in which the lead portion (the portion penetratin...

Claims

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Application Information

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IPC IPC(8): B23K3/00H05K3/34
Inventor 松浦信博山口薰
Owner 株式会社东北弘辉